Moisture-absorption, dielectric relaxation, and thermal conductivity studies of polymer composites

Lu, Xihua; Xu, Gu; Hofstra, Peter G.; Bajcar, Robert C.

doi:10.1002/(sici)1099-0488(19980930)36:13<2259::aid-polb2>3.0.co;2-o

Cited by 69 publications

(22 citation statements)

References 4 publications

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“…The Agari model based on two phases was considered. The expression that governs the thermal conductivity of the composition is given as follows 33,34 log k c ¼ V HGM C 2 log k HGM þ ð1 À HGM Þ logðC 1 k m Þ ð4Þ where C 1 , C 2 are experimentally determined constants of order unity. C 1 is a measure of the effect of the particles in the secondary structure of the polymer, like crystallinity and the crystal size of the polymer.…”

Section: Numerical Resultsmentioning

confidence: 99%

Thermal conductivity and compressive properties of hollow glass microsphere filled epoxy–matrix composites

Qiao

Xiao-dong

Zhang

et al. 2015

Journal of Reinforced Plastics and Composites

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The density, thermal conductivity, and compressive properties of hollow glass microsphere (HGM)-filled epoxy composites were investigated in the present paper. The volume fraction of HGM was varied from 0 to 50 vol.%. The results showed density, thermal conductivity, compressive modulus, and compressive strength of the composites decreased with the increase of HGM volume fraction, which indicated that the properties related above were mainly dependent on the content of HGM. To conveniently predict thermal conductivity in the investigated materials system, five effective thermal conductivity models were analyzed and compared with the experimental data. The Agari model was applied to predict thermal conductivity of HGM-filled epoxy composites, and the results indicated thermal conductivity and compressive properties of epoxy-matrix composites can be modified by changing the HGM volume fraction, this discover would make it become a promising engineering material in the related fields.

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Section: Numerical Resultsmentioning

confidence: 99%

Thermal conductivity and compressive properties of hollow glass microsphere filled epoxy–matrix composites

Qiao

Xiao-dong

Zhang

et al. 2015

Journal of Reinforced Plastics and Composites

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“…For example, Lu et al took moisture-absorption, dielectric, and thermal-conduction as research points for comparing the differences and assessing the strong/weak points of each type of polymeric composite. It was concluded that silicone polymers embedded with boron nitride (BN) can best serve as the coating of electronic devices that require heat dissipation and moisture resistance, in addition to electrical insulation [4]. Xu et al studied the filler effect for the coefficients of thermal conductivity of epoxy/aluminum nitride (AlN) compounds, by adding varied fillers.…”

Section: Introductionmentioning

confidence: 98%

Thermal conductivity and electrical conductivity of silicone rubber filled with aluminum nitride and aluminum powder

Chiu

Liu

Lin

et al. 2013

Journal of Polymer Engineering

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The effects of aluminum nitride (AlN) and aluminum powder (Al) on thermal conductivity and electrical conductivity of silicone rubber compounds were investigated and it was found that the thermal conductivity increased with increased fillers content. Silicone rubber filled with Al powder of 45 μm over 50 phr, exhibits higher thermal conductivity as compared to that filled with AlN powder of 4 μm at the same filler content. The results indicate that the particle size effect played a significant role on thermal conductivity. In addition, it was found that electrical conductivity and thermal conductivity increased proportionally when the Al powder content increased. In contrast, only the thermal conductivity kept increasing proportionally, but the electrical conductivity almost remained unchanged for the rubber with AlN. Furthermore, a new type of silicone rubber compound with a combination of the two fillers, comprising 100 phr of AlN powder and 50 phr of Al powder, was developed, which lead to synergistic enhancement of the thermal conductivity. The improvement in thermal stability of the new type of silicone rubber compounds enables use in high temperature environments.

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“…An effective method of displacing the air involves the use of a thermal interface material (a material placed at the interface). [4][5][6][7][8][9][10][11][12] This material should conform to the surface topography of the mating surfaces, thereby displacing the air. Furthermore, this material should be thin in the direction perpendicular to the interface, as the thermal resistance associated with the interface material itself increases with increasing thickness of the thermal interface.…”

Section: Introductionmentioning

confidence: 99%

Carbon-black thixotropic thermal pastes for improving thermal contacts

Leong

Aoyagi

Chung

2005

Journal of Elec Materi

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This paper addresses thermal interface materials for thermal conduction of excess heat for microelectronic applications. Carbon black (30 nm) thixotropic paste based on polyol ethers is comparable to carbon black fluidic paste based on polyethylene glycol (PEG) in its effectiveness as a thermal paste, and in its dependence on pressure history. Prior pressure (up to 0.69 MPa) application is helpful. The optimum carbon black content is 2.4 vol.% for the thixotropic paste. The thermal contact conductance across copper surfaces is 30 ϫ 10 4 and 11 ϫ 10 4 W/m 2 -°C for surface roughness of 0.05 µm and 15 µm, respectively. The volume electrical resistivity is 3 ϫ 10 3 Ω-cm. Boron nitride (BN) (5-11 µm) and graphite (5 µm) thixotropic pastes are less effective than carbon black thixotropic paste by up to 70% and 25%, respectively, in thermal contact conductance, due to low conformability.

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Moisture-absorption, dielectric relaxation, and thermal conductivity studies of polymer composites

Cited by 69 publications

References 4 publications

Thermal conductivity and compressive properties of hollow glass microsphere filled epoxy–matrix composites

Thermal conductivity and compressive properties of hollow glass microsphere filled epoxy–matrix composites

Thermal conductivity and electrical conductivity of silicone rubber filled with aluminum nitride and aluminum powder

Carbon-black thixotropic thermal pastes for improving thermal contacts

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