2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
DOI: 10.1109/ectc.2000.853200
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Module packaging for high-speed serial and parallel transmission

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Cited by 8 publications
(4 citation statements)
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“…2) The production technology for the optical parts, makes it furthermore possible to assembly and test the different optical parts on wafer level, which is very attractive from production cost of view [7,8].…”
Section: Optical Bi-directional Subassembliesmentioning
confidence: 99%
See 1 more Smart Citation
“…2) The production technology for the optical parts, makes it furthermore possible to assembly and test the different optical parts on wafer level, which is very attractive from production cost of view [7,8].…”
Section: Optical Bi-directional Subassembliesmentioning
confidence: 99%
“…The TO-modules used in transceivers are typically mounted on small printed circuit boards (PCBs) with the circuitry required inside the transceivers (see e.g. [8]). For this project, PCBs and circuitry already developed for the Infineon transceiver with one BIDI unit was used, even though a mechanically modified solution with different physical Fig.…”
Section: Implementation Of a Dual Bi-directional Transceiver Prototypementioning
confidence: 99%
“…The packaging parasitics of a semiconductor laser are very important since they affect the modulation response of the packaged device at high frequencies [1,2], and knowledge of the effects of the packaging network is necessary in order to achieve a good high-frequency performance for laser diode and module [3,4]. Usually, the conventional comparison method, based on direct subtraction between the measured high-frequency responses of the laser before and after being packaged, is used for potential frequency-bandwidth estimation [5].…”
Section: Introductionmentioning
confidence: 99%
“…1 and include elements such as lenses ͑refractive or diffractive microlenses, 1,2 ball lenses, 3 graded-index lenses͒ 4 or interconnecting parts based on flexible waveguides. 5,6 In this fashion, only single elements or small arrays can be processed at a time and an accurate alignment of all components with respect to each other is required.…”
Section: Introductionmentioning
confidence: 99%