“…However, TE solutions for microelectronic applications need to operate close to room temperature (RT), TE efficiency being mainly dependent on intrinsic material properties, such as thermal conductivity ( κ ), electrical conductivity ( σ ), and Seebeck coefficient ( S ), TE technology improvement requires either the development of new materials, or to develop engineering methods allowing TE properties of current materials to be improved. Concurrent with κ engineering, recent band engineering solutions were proposed to increase the TE power factor PF = S 2 σ 6 , such as modulation doping 7 , 8 , resonance levels 9 , 10 , energy filtering 11 – 13 , and quantum confinement 14 . The thermopower S is related to the Peltier coefficient П such as S = П/ T , П corresponding to the energy carried by the mobile charge carriers in the material per unit of charge.…”