2018
DOI: 10.1007/s00339-018-1899-4
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Modification of polymer gate dielectrics for organic thin-film transistor from inkjet printing

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Cited by 9 publications
(9 citation statements)
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“…To stop the flow, the polarity of the voltage is reversed, expanding the nozzle. This inkjet printing deposition method is suitable for complex morphologies and arrays of materials [ 140 , 141 , 142 , 143 , 144 , 145 ]. Figure 20 shows an illustration of the inkjet printing method.…”
Section: Inkjet Printing Methodsmentioning
confidence: 99%
“…To stop the flow, the polarity of the voltage is reversed, expanding the nozzle. This inkjet printing deposition method is suitable for complex morphologies and arrays of materials [ 140 , 141 , 142 , 143 , 144 , 145 ]. Figure 20 shows an illustration of the inkjet printing method.…”
Section: Inkjet Printing Methodsmentioning
confidence: 99%
“…This dielectric features a smooth surface (RMS roughness of approx. 0.2 nm), low leakage current density, and a high breakdown electric field (> 10 MV/cm) [23,24]. In addition, silicon oxide is chemically resistant, withstanding photolithography of electrodes and semiconductor deposition.…”
Section: Introductionmentioning
confidence: 99%
“…That comes in spite of a common gate electrode for all transistors. Incompatible with large-area flexible substrates, SiO2 requires bulky and expensive equipment to be grown at temperatures (T) over 1,000°C [24]. Furthermore, a self-assembled monolayer (SAM) is needed in order to decrease charge carrier trapping at the semiconductor/dielectric interface and, consequently, enhance the effective mobility [25].…”
Section: Introductionmentioning
confidence: 99%
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“…This dielectric features a smooth surface (RMS roughness of ca. 0.2 nm), low leakage current (~10 nA/cm 2 at 0.2 MV/cm), and a breakdown electric field higher than 10 MV/cm [2,3]. In addition, it can withstand photolithography of source and drain electrodes, as well as semiconductor deposition.…”
Section: Introductionmentioning
confidence: 99%