Modification of epoxy resin using reactive liquid (ATBN) rubber

Chikhi, Nourdine; Fellahi, S.; Bakar, M.

doi:10.1016/s0014-3057(01)00194-x

Cited by 377 publications

(295 citation statements)

References 40 publications

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“…Approaches to enhance the adhesive and mechanical strength of the final products have included the addition of particulate fillers, [1][2][3] reactive liquid rubbers, [4][5][6][7][8][9][10] and thermoplastic polymers. [11][12][13][14][15] Epoxy resin's properties have also been improved by using nanoparticles [16][17][18][19][20] as well as other cross-linkable polymers to form full-or semi-interpenetrating polymer networks.…”

Section: Introductionmentioning

confidence: 99%

Preparation and property evaluation of nanocomposites based on polyurethane‐modified epoxy/montmorillonite systems

Bakar¹,

Kostrzewa²,

Hausnerová³

et al. 2010

Adv Polym Technol

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Montmorillonite nanoclay and polyurethanes obtained from polyethylene glycol (PUR 400) and polyoxypropylene diol (PUR 1002) were used to enhance the mechanical properties of an epoxy resin. Maximum impact strength improvement was obtained with compositions containing 2% nanoclay and 10% PUR 400 as well as that with 1% nanoclay and 15% PUR 400, corresponding to 110% and 75%, respectively, in relation to the unmodified epoxy resin. Moreover, a 10-fold increase was observed with respect to the flexural strain at break for the composition containing 15% PUR 1002 and 2% nanoclay.

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Section: Introductionmentioning

confidence: 99%

Preparation and property evaluation of nanocomposites based on polyurethane‐modified epoxy/montmorillonite systems

Bakar¹,

Kostrzewa²,

Hausnerová³

et al. 2010

Adv Polym Technol

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“…Due to their many advantages, liquid rubbers, including ATBN or carboxylterminated poly(butadiene-co-acrylonitrile) (CTBN), have been utilized to make brittle polymers more ductile, and in particular to toughen thermosetting polymers such as epoxy, unsaturated polyester, vinyl ester, and phenolic resins [97][98][99].…”

Section: Dynamic Mechanical and Thermal Properties Of Peti-5/xgnp Commentioning

confidence: 99%

“…However, their brittleness restricts other potential uses. ATBN has been utilized as an impact modifier of epoxy for this reason [97,100,101]. In many cases, a relatively large amount of ATBN, higher than 10 wt%, has been used to toughen epoxy, resulting in a considerable decrease in mechanical and thermal properties [101,102].…”

Section: Dynamic Mechanical and Thermal Properties Of Peti-5/xgnp Commentioning

confidence: 99%

Phenylethynyl-terminated polyimide, exfoliated graphite nanoplatelets, and the composites: an overview

Cho

Drzal²

2016

Carbon letters

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In efforts to characterize and understand the properties and processing of phenylethynylterminated imide (LaRC PETI-5, simply referred to as PETI-5) oligomers and polymers as a high-temperature sizing material for carbon fiber-reinforced polymer matrix composites, PETI-5 imidization and thermal curing behaviors have been extensively investigated based on the phenylethynyl end-group reaction. These studies are reviewed here. In addition, the use of PETI-5 to enhance interfacial adhesion between carbon fibers and a bismaleimide (BMI) matrix, as well as the dynamic mechanical properties of carbon/BMI composites, are discussed. Reports on the thermal expansion behavior of intercalated graphite flake, and the effects of exfoliated graphite nanoplatelets (xGnP) on the properties of PETI-5 matrix composites are also reviewed. The dynamic mechanical and thermal properties and the electrical resistivity of xGnP/PETI-5 composites are characterized. The effect of liquid rubber amine-terminated poly(butadiene-co-acrylonitrile) (ATBN)-coated xGnP particles incorporated into epoxy resin on the toughness of xGnP/epoxy composites is examined in terms of its impact on Izod strength. This paper provides an extensive overview from fundamental studies on PETI-5 and xGnP, as well as applied studies on relevant composite materials.Key words: polyimide, exfoliated graphite nanoplatelets, carbon fiber, composite, properties Phenylethynyl-Terminated Imide PolymerPolyimides have been extensively used in the electronics industry [1] as coatings, films, or adhesives and also in composite applications [2] as a primary or secondary structural material. When incorporated with organic or inorganic fibers, including carbon fibers and glass fibers, they can potentially be applied as a sizing material for high-temperature uses. In advanced applications, one of the most desirable advantages of polyimides, especially the aromatic polyimides, is their excellent high-temperature performance. Their thermal characteristics, including high temperature stability and cure behavior, are critical to successful processing and to the final properties of the resulting polyimide. For aerospace and aircraft applications, advanced polymer materials must successfully maintain their properties at high service temperatures over a long exposure time [3][4][5].The important parameters influencing the heat resistance of a polymeric material are its glass transition temperature (T g ), melting point (T m ), thermal stability, and etc., which may depend on its thermal history. Accordingly, polymers that are used to fulfill such high temperature performance should exhibit a high T g or T m and have excellent thermal stability. Even though some polyimides meet the high temperature requirement, their uses have been limited due to processing difficulties, such as poor solubility in common solvents, the release of volatiles, brittleness, and high processing temperature [6,7].Aromatic polyimides, especially acetylene or ethynyl-terminated polyimides, have been extensiv...

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“…[14][15][16][17][18][19][20][21][22][23]. While terminal reactive groups of both CTBN and ATBN react with epoxy groups to form a polymer matrix, their 23].…”

Section: Introductionmentioning

confidence: 99%

Synthesis of Benzene Tetracarboxamide Polyamine and Its Effect on Epoxy Resin Properties

Lee

Seo

et al. 2018

Polymers

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Epoxy resins have found various industrial applications in high-performance thermosetting resins, high-performance composites, electronic-packaging materials, adhesives, protective coatings, etc., due to their outstanding performance, including high toughness, high-temperature performance, chemical and environmental resistance, versatile processability and adhesive properties. However, cured epoxy resins are very brittle, which limits their applications. In this work, we attempted to enhance the toughness of cured epoxy resins by introducing benzene tetracarboxamide polyamine (BTCP), synthesized from pyromellitic dianhydride (PMDA) and diamines in N-methyl-2-pyrrolidone (NMP) solvent. During this reaction, increased viscosity and formation of amic acid could be confirmed. The chemical reactions were monitored and evidenced using 1 H-NMR spectroscopy, FT-IR spectroscopy, water gel-phase chromatography (GPC) analysis, amine value determination and acid value determination. We also studied the effect of additives on thermomechanical properties using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamical mechanical analysis (DMA), thermomechanical analysis (TMA) and by measuring mechanical properties. The BTCP-containing epoxy resin exhibited high mechanical strength and adhesion strength proportional to the amount of BTCP. Furthermore, field-emission scanning electron microscopy images were obtained for examining the cross-sectional morphology changes of the epoxy resin specimens with varying amounts of BTCP.

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Modification of epoxy resin using reactive liquid (ATBN) rubber

Cited by 377 publications

References 40 publications

Preparation and property evaluation of nanocomposites based on polyurethane‐modified epoxy/montmorillonite systems

Preparation and property evaluation of nanocomposites based on polyurethane‐modified epoxy/montmorillonite systems

Phenylethynyl-terminated polyimide, exfoliated graphite nanoplatelets, and the composites: an overview

Synthesis of Benzene Tetracarboxamide Polyamine and Its Effect on Epoxy Resin Properties

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