Modelling the effect of geometrical scaling on micro-electronic packaging

Hyslop, D.C.; Müller, Wolfgang; Ng, Kenny; Tan, K. H.; Albrecht, H.

doi:10.1109/emap.2000.904139

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)

DOI: 10.1109/emap.2000.904139

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Modelling the effect of geometrical scaling on micro-electronic packaging

D.C. Hyslop

Wolfgang Müller²,

Kenny Ng³

et al.

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Modelling the reliability of high-density substrates and associated microelectronic components

Albrecht

Hyslop²,

Jendrny³

et al.

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456)

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This paper presents lifetime predictions, based on Finite Element Analysis (FEA), for the copper via connectors present in High Density Interconnectors (HDI) used for mounting of CSP's. The life-saving impact of various fillings of these connectors is investigated using different FEsub-models for capturing the intricate HDI substructure. A ranking of the impact on lifetime of the various fillings is presented. Moreover, the structural integrity of the solder bumps of a flip chip structure with and without underfill is examined using FE. It is demonstrated analytically that the underfill may lead to an improvement in lifetime of 300% and more.

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Modelling the reliability of high-density substrates and associated microelectronic components

Albrecht

Hyslop²,

Jendrny³

et al.

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456)

View full text Add to dashboard Cite

show abstract

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Modelling the effect of geometrical scaling on micro-electronic packaging

Cited by 1 publication

References 3 publications

Modelling the reliability of high-density substrates and associated microelectronic components

Modelling the reliability of high-density substrates and associated microelectronic components

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