2018
DOI: 10.1016/j.applthermaleng.2017.10.156
|View full text |Cite
|
Sign up to set email alerts
|

Modelling of two-phase closed thermosyphon based on SINDA/FLUINT

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

1
2
0

Year Published

2020
2020
2024
2024

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 10 publications
(3 citation statements)
references
References 14 publications
1
2
0
Order By: Relevance
“…The reason this phenomenon occurs is that, with the increase in input power, the evaporation rate of the working fluid in the evaporation section of the two-phase closed thermosyphon increases, and the working fluid cannot be added back in time, thereby decreasing the heat transfer performance. The equivalent thermal conductivity of the two-phase closed thermosyphons with total lengths of 320 mm and 500 mm increases with increasing heat transfer rate, which is consistent with the results reported in references [8] and [26]. The equivalent thermal conductivity of the former increased from 1296.69 W•m -1 •K -1 to 1375.84 W•m -1 •K -1 (a 6.10 increase), whereas that of the latter increased from 1539.88 W•m -1 •K -1 to 1694.19 W•m -1 •K -1 (a 10.02 increase).…”
Section: Resultssupporting
confidence: 91%
See 1 more Smart Citation
“…The reason this phenomenon occurs is that, with the increase in input power, the evaporation rate of the working fluid in the evaporation section of the two-phase closed thermosyphon increases, and the working fluid cannot be added back in time, thereby decreasing the heat transfer performance. The equivalent thermal conductivity of the two-phase closed thermosyphons with total lengths of 320 mm and 500 mm increases with increasing heat transfer rate, which is consistent with the results reported in references [8] and [26]. The equivalent thermal conductivity of the former increased from 1296.69 W•m -1 •K -1 to 1375.84 W•m -1 •K -1 (a 6.10 increase), whereas that of the latter increased from 1539.88 W•m -1 •K -1 to 1694.19 W•m -1 •K -1 (a 10.02 increase).…”
Section: Resultssupporting
confidence: 91%
“…Wang et al [7] used the modified Lee model based on the volume of fluid (VOF) method and the original Lee model to model the heat transfer behavior of a thermosyphon during geyser boiling via computational fluid dynamics (CFD). Limin et al [8] established a transient simulation model of a thermosyphon using SINDA/FLUINT 5.6. The evaporation section was heated with a water bath and the heat transfer rate and the total heat transfer coefficient increased with increasing water bath temperature.…”
Section: Introductionmentioning
confidence: 99%
“…A combination of system-level analysis and high level of detail for heat exchangers was implemented through a complex thermal-fluid network construction. In various areas, such as building structures [47], solid desiccant [48], thermosyphon [49], and heat pipes [50], R-C network models have been widely used. In the case of HP, additional problems were found in the application.…”
Section: Scope Of Studymentioning
confidence: 99%