Abstract:For the design and simulation of high speed interconnection systems and fast digital computers it is imperative to consider both the two-dimensional modelling of bus structures in different technologies and to take the presence of so-called discontinuities (e.g. via-holes, line crossings, packages and connectors) into account. The paper presents quasi-TEM capacitance calculations based on an integral equation technique. As typical examples we studied the effect of etching on the impedance of striplines and imp… Show more
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