Modelling and experimental investigation on nanometric cutting of monocrystalline silicon

Fang, Fengzhou; Wu, H.; Liu, Y.C.

doi:10.1016/j.ijmachtools.2005.03.010

Cited by 244 publications

(115 citation statements)

References 30 publications

Supporting

Mentioning

108

Contrasting

Unclassified

Order By: Relevance

“…The ultra-precision machine tool which is a powerful tool in realizing the machining of freeform surfaces [3] and micro/nano-structural elements [4] is also an effective tool in investigating the micro/nano-cutting process by applying particular methods, such as the tapper cutting [5], orthogonal cutting [6] and so on. Besides that, a self-developed cutting device which could be integrated to scanning electron microscope (SEM) could be used to realize the online observation of cutting process [7].…”

Section: Investigation Approachesmentioning

confidence: 99%

See 1 more Smart Citation

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

Fang

2018

Nanomanuf Metrol

View full text Add to dashboard Cite

Micro-and nano-machining technology has been applied in industry to generate high-precision parts with micro/nanometric accuracy or feature size in the recent decades. Cutting is one of the most powerful manufacturing processes, and the material removal mechanism is urgently demanded by the industry to understand and improve the micro/nano-machining process efficiently at a low cost. This paper presents the recent advances in cutting mechanism and its applicability for predicting the surface generation and chip formation, especially when material is removed in micro-and nanoscale. In addition to the industry-concerned performance parameters, fundamental physical parameters such as stresses, strains, temperatures, phase transformation, minimum uncut chip thickness and size effects are discussed in this paper for the indepth understanding of the micro/nano-cutting process.

show abstract

Section: Investigation Approachesmentioning

confidence: 99%

“…In nanocutting process, Fang et al [5,94,113] investigated the influence of the tool edge radius on nano-cutting mechanism by both molecular dynamics analysis and experimental study. The results showed that the atoms are extruded in front of the cutting tool, when the UCT is 1 nm and edge radius is 5 nm.…”

Section: Influence On Chip Formation and Minimum Uctmentioning

confidence: 99%

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

Fang

2018

Nanomanuf Metrol

View full text Add to dashboard Cite

show abstract

“…Single-crystal Si is a difficult-to-machine material with high brittleness and high hardness [1,2]. Electric discharge machining (EDM) [3][4][5] technology for high-efficiency, the high-quality processing of single-crystal Si has become a research topic of great interest [6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Dynamic Observer Modeling and Minimum-Variance Self-Tuning Control of EDM Interelectrode Gap

Xin

Yin

et al. 2018

Applied Sciences

View full text Add to dashboard Cite

Featured Application: Applying on electric discharge machining. Abstract:The electric discharge machining (EDM) interelectrode gap directly determines the discharge state, which affects the machining efficiency, workpiece surface quality, and the tool wear rate. The measurement of the real-time varying interelectrode gap during machining is extremely difficult, and so obtaining an accurate mathematical model of the dynamic interelectrode gap will make EDM gap control possible. Based on p-type single-crystal silicon EDM, a flat-plate capacitance model is introduced to analyze the time-domain characteristics of the inter-electrode voltage in the breakdown delay phase. Further, we theoretically established a physical model of the interelectrode spacing d and the charging time constant τ of the plate capacitor. The least-squares fitting of the experimental data was used to determine the model coefficients, and in combination with the actual machining process, a minimum-variance self-tuning controller was designed to control the interelectrode gap in real time. The experimental verification results show that the established physical model can correctly predict the interelectrode gap in the actual machining process. The minimum-variance self-tuning controller improves machining stability, and eliminates the occurrence of the short-circuit state.

show abstract

“…Therefore，using cutting theory based on the traditional continuous medium mechanics to explain the cutting process is questionable, so, it must study the atomic state in cutting region、cutting force and workpiece temperature in the process of nanometric cutting from the perspective of the molecule and atom. Molecular dynamics (MD) method has a function of communicating macroscopic properties with microstructure and it has been proved to be an effective method to study the nanometric machining [1][2][3][4].…”

Section: Introductionmentioning

confidence: 99%

Simulation Analysis of the Effects of Tool Rake Angle for Workpiece Temperature in Single Crystal Copper Nanometric Cutting Process

Jiang-hua¹,

Zhang²,

Wang³

et al. 2016

IJHIT

View full text Add to dashboard Cite

show abstract

Modelling and experimental investigation on nanometric cutting of monocrystalline silicon

Cited by 244 publications

References 30 publications

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

Dynamic Observer Modeling and Minimum-Variance Self-Tuning Control of EDM Interelectrode Gap

Simulation Analysis of the Effects of Tool Rake Angle for Workpiece Temperature in Single Crystal Copper Nanometric Cutting Process

Contact Info

Product

Resources

About