2018 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO) 2018
DOI: 10.1109/nemo.2018.8503451
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Modeling Thermal Coupling in Bipolar Power Amplifiers toward Dynamic Electrothermal Simulation

Antonio Pio Catalano
1
,
Lorenzo Codecasa
2
,
Brian Moser Qorvo
3
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Cited by 16 publications
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References 12 publications
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3-D FEM Investigation on Electrical Ruggedness of Double-Sided Cooled Power Modules

Scognamillo
1
,
Catalano
2
,
Trani
3
et al. 2020
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
4
0
1
0
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3-D FEM Investigation on Electrical Ruggedness of Double-Sided Cooled Power Modules

Scognamillo
1
,
Catalano
2
,
Trani
3
et al. 2020
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
4
0
1
0
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Numerical Simulation and Analytical Modeling of the Thermal Behavior of Single- and Double-Sided Cooled Power Modules

Catalano
1
,
Scognamillo
2
,
d’Alessandro
3
et al. 2020
IEEE Trans. Compon., Packag. Manufact. Technol.
30
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14
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Analytical Modeling of Through-PCB Thermal Vias and Heat-Sinks for Integrated Power Electronics

Catalano
1
,
Trani
2
,
Castellazzi
3
et al. 2019
2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
6
0
1
0
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