Modeling the stability of electroless plating bath—diffusion of nickel colloidal particles from the plating frontier

Electroless Ni–Cu–P plating onto open cell stainless steel foam

“…Hence, the addition of CuSO 4 Á5H 2 O will inhibit Ni reduction resulting in deposition rate decrease [20]. The recent studies found that Cu played three different roles: as a stabilizer (due to the reduction of adsorbed Cu +2 to Cu and Cu + ); as an accelerator (due to the catalytic properties of Ni-Cu alloys); and as affecting the solution stability (due to the formation of randomly dispersed copper particles in the solution) [16,[23][24][25][26][27].…”

Hydrogen generation from catalytic hydrolysis of sodium borohydride using bimetallic Ni–Co nanoparticles on reduced graphene oxide as catalysts

“…However, for the electroless deposition process to take place on an electrically insulating substrate like GO, it is necessary to Sn-sensitize and Pd-activate these substrates beforehand, through which Pd 0 particles are formed on the substrates to provide the initial active sites for the electroless deposition process [27].…”

“…The Ni contents of NieCo/r-GO catalysts prepared from both electroless plating processes are higher than the Co contents, respectively. Low contents of phosphorus inevitably appears on both catalysts, as disproportionation of hypophosphite anions used as the reducing agent in the electroless NieCo plating results in the formation of P (0) on the alloys [27]. The phosphorus contents on NieCo/ r-GO(sim) and NieCo/r-GO(suc) catalysts relative to the combined contents of Ni, Co and P were 8.9 wt% and 6.4 wt%, respectively.…”

“…An EDP (electroless deposition process) is often referred as an autocatalytic process as, once being initiated, the metals can be continuously reduced onto the as-deposited metal fronts without the use of any external current [26,27]. Furthermore, an EDP can be carried out on any surface with proper pretreatments [27]. On nonconductive plating surfaces like GO, Sn-sensitization and Pd-activation prior to an EDP is necessary and schematically shown in Fig.…”

Preparation of core-shell Cu-Ag bimetallic powder via electroless coating

“…Pd metal acting as activator in electroless coating was reported in the Refs. [9][10][11][12], where, AgNO 3 was used to replace the conventional PdCl 2 as activator.…”