Abstract:Strip warpage is a common problem in molded leadframe packages. When warpage becomes excessive, the strip could not be processed as it would result in the strip being stuck or damaged during loading to the handling machine loader. This study focuses on the impact of mold cap thickness on strip warpage of a molded Quad Flat No Lead (QFN) package to provide guidance in reducing the strip warpage to an acceptable level. Different mold thickness values were considered in the modeling using finite element analysis … Show more
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