A magnetostrictive wire-bonding clamp for use in semiconductor packaging applications has been developed by Mechatronic Technology Co. Semiconductor industry trends, requiring high process throughput on increasing lead count packages, make the magnetostrictive material Terfenol-D a candidate for this application. To construct this small, lightweight device, small samples of Terfenol-D were prepared by ETREMA Products, Inc. This paper reports the initial design, mathematical modeling, and experiments related to this initial prototype.