Modeling of texture evolution in copper under equal channel angular pressing

Baik, Seung‐Chul; Estrin, Yuri; Hellmig, Ralph Jörg; Jeong, Hyo‐Tae; Brokmeier, Heinz Günter; Kim, Hyoung Seop

doi:10.3139/146.031189

Cited by 46 publications

(19 citation statements)

References 17 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[59] As a result, (1) slip system activity coupled with (2) differences in entry texture due to a prescribed route and (3) the deformation necessitated by additional passes leads to variations in the orientation position (or ''stability'') of individual ideal components within the bulk texture. [59] Our texture measurements agree with Baik et al [60] on the overall reduction of the texture intensities for route B C from N = 1 to 4. However, this trend is in contradiction with other investigations, [33,61] where an increase in texture strength after N = 4, 8, and 12 was found.…”

Section: Texture Evolutionsupporting

confidence: 90%

Grain Size, Misorientation, and Texture Evolution of Copper Processed by Equal Channel Angular Extrusion and the Validity of the Hall–Petch Relationship

Torre

Gazder

et al. 2007

Metall Mater Trans A

View full text Add to dashboard Cite

The microstructure and texture of copper subjected to equal channel angular extrusion (ECAE) via route B C for up to 16 passes have been assessed using electron backscatter diffraction (EBSD), transmission electron microscopy (TEM), X-ray diffraction (XRD) peak broadening, and texture analysis. The differences in grain size measured by these techniques allows for an understanding of microstructural evolution. A gradual decrease in grain size occurs with an increasing number of passes, while the subgrain size remains approximately constant. Up to four passes, the fraction of high-angle grain boundaries (HAGBs) (>15 deg) increases from 15 to 45 pct, but remains constant thereafter. The grain boundary character distribution shows a decrease of S1 boundaries and an increase of S3 boundaries with higher passes. After 16 passes, a few regions of large 1 to 4 lm sized grains embedded in a submicrometer sized matrix were observed. These agglomerates of larger grain diameters together with the measured decrease in the dislocation density correlate with the observed decrease in yield strength of samples subjected to four and more passes. Texture evolution is adequately described under conditions of negative simple shear. The effect of increased accumulated strain results in an overall spread of orientation densities due to the absence of stable end positions post-ECAE. Detailed microstructural information suggests that strengthening mechanisms in the material can be sufficiently well described by the classical Hall-Petch relationship by applying it to the subgrain size, while the subgrain size remains smaller than the grain size.

show abstract

Section: Texture Evolutionsupporting

confidence: 90%

Grain Size, Misorientation, and Texture Evolution of Copper Processed by Equal Channel Angular Extrusion and the Validity of the Hall–Petch Relationship

Torre

Gazder

et al. 2007

Metall Mater Trans A

View full text Add to dashboard Cite

show abstract

“…Several studies regarding the texture evolution in Al and its alloys [e.g., 3,16,17,[19][20][21]25,30] have demonstrated a similarity between the textures developed by ECAP and those imposed by a simple shear large-strain deformation. At the same time it is worth to expect that some additional lattice rotations can take place when the specimen is processed by repetitive ECAP [15]. Analysis of [3,7,12,[15][16][17][18]20,21,24,25] also suggests that texture changes may also depend on such deformation factors, as the route of ECAP, number of ECAP passes, deformation temperature, etc.…”

Section: Accepted Manuscriptmentioning

confidence: 99%

Microstructural and texture changes during equal channel angular pressing of an Al–Mg–Sc alloy

Sitdikov

Avtokratova

Sakai

2015

Journal of Alloys and Compounds

View full text Add to dashboard Cite

“…In the mentioned model, a material is considered as a twophase one, composed of cell interiors containing a low dislocation density and cell walls with a high dislocation density. The model was presented in detail in these earlier articles, [8][9][10][11] and therefore, only its salient features relevant to the present study will be discussed here. The total dislocation density, q tot , is calculated from the dislocation density in the cell walls, q w , and the dislocation density, q c , in the cell interiors.…”

Section: A Materials Modelmentioning

confidence: 99%

Forming Nanocrystalline Structures in Metal Particle Impact

Lemiale

Estrin

Kim

et al. 2010

Metall Mater Trans A

Self Cite

View full text Add to dashboard Cite

Grain refinement by plastic deformation is becoming increasingly popular as a way of producing metals with improved properties, such as higher mechanical strength. Surface treatment techniques in which a metallic substrate is bombarded with metallic particles can generate nanocrystalline layers in the impact zone. Understanding the physical mechanisms underlying this grain refinement is crucial for achieving an improvement of existing experimental processes. In this article, we propose a numerical framework combining finite element (FE) simulations with a dislocation-based material model to predict the evolution of the microstructure under particle impact. A single particle normally impacting on a metallic substrate was simulated at different initial velocities. The simulations were compared with previously reported numerical and experimental data. The results indicate that our model accurately captures the grain refinement in the impact zone for a broad range of velocities. This approach provides valuable information on the formation of nanocrystalline layers in both the substrate and the impacting particle. Its potential applications include processes involving surface treatment by high velocity particles, such as shot peening, surface mechanical attrition treatment, kinetic metallization, cold spray, etc.

show abstract

Modeling of texture evolution in copper under equal channel angular pressing

Cited by 46 publications

References 17 publications

Grain Size, Misorientation, and Texture Evolution of Copper Processed by Equal Channel Angular Extrusion and the Validity of the Hall–Petch Relationship

Grain Size, Misorientation, and Texture Evolution of Copper Processed by Equal Channel Angular Extrusion and the Validity of the Hall–Petch Relationship

Microstructural and texture changes during equal channel angular pressing of an Al–Mg–Sc alloy

Forming Nanocrystalline Structures in Metal Particle Impact

Contact Info

Product

Resources

About