Modeling of Spiral Inductors

Okada, Kei; Masu, Kazuya

doi:10.5772/8435

Cited by 20 publications

(12 citation statements)

References 6 publications

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“…(2) where L @WF and Q @WF are the inductance and quality factor at the working frequency (WF), which, in this case, is the center of the ISM band (2.45GHz) [20]. The inductance and quality factor at any frequency can be easily obtained from the Sparameters [27]. The second and third constraint in (2) guarantee that the inductance is very flat around the WF.…”

Section: A Device-level Synthesismentioning

confidence: 99%

A Multilevel Bottom-Up Optimization Methodology for the Automated Synthesis of RF Systems

Passos

Roca

Sieiro

et al. 2020

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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In recent years there has been a growing interest in electronic design automation methodologies for the optimizationbased design of radiofrequency circuits and systems. While for simple circuits several successful methodologies have been proposed, these very same methodologies exhibit significant deficiencies when the complexity of the circuit is increased. The majority of the published methodologies that can tackle radiofrequency systems are either based on high-level system specification tools or use models to estimate the system performances. Hence, such approaches do not usually provide the desired accuracy for RF systems. In this work, a methodology based on hierarchical multilevel bottom-up design approaches is presented, where multi-objective optimization algorithms are used to design an entire radiofrequency system from the passive component level up to the system level. Furthermore, each level of the hierarchy is simulated with the highest accuracy possible: electromagnetic simulation accuracy at device-level and electrical simulations at circuit/system-level.

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Section: A Device-level Synthesismentioning

confidence: 99%

A Multilevel Bottom-Up Optimization Methodology for the Automated Synthesis of RF Systems

Passos

Roca

Sieiro

et al. 2020

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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“…The lumped element model in Fig. 14 is based on [27] with the addition of L2, which is the result of the bottom layer interconnect and via. Similar to the capacitors, the lumped element values are obtained by measured Y -parameter matching with Advanced Design System.…”

Section: B Inductorsmentioning

confidence: 99%

Fully Inkjet Printed RF Inductors and Capacitors Using Polymer Dielectric and Silver Conductive Ink With Through Vias

McKerricher

Perez

Shamim

2015

IEEE Trans. Electron Devices

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In this paper, fully inkjet printed multilayer capacitors and inductors are fabricated and characterized using poly 4-vinylphenol (PVP) ink as the dielectric layer and silver nanoparticle ink as the conductor. Inkjet printed through vias, created with a novel dissolving method are used to make RF structures in a multilayer inkjet printing process. The vias have been realized in a 350-nm PVP film and exhibit resistance better than 0.1 . Spiral inductors from 10 to 75 nH have been realized with maximum quality factors around five. The 10-nH inductor exhibits a self-resonant frequency slightly below 1 GHz. Metal-insulator-metal capacitors are realized with densities of 50 pF/mm 2 . These capacitors demonstrate values ranging from 16 to 50 pF. The 16-pF capacitor shows a self-resonant frequency over 1.5 GHz. The successful implementation of inductors and capacitors in an all inkjet printed multilayer process with vias is an important step toward fully inkjet-printed large area and flexible RF systems.

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“…where L @WF and Q @WF are the inductance and quality factor at the working frequency (WF). The inductance and quality factor at any frequency can be easily obtained from the Sparameters [15]. The second to fourth constraint in (4) guarantee that the inductance is sufficiently flat up to around the working frequency.…”

Section: Inductor Pof Generationmentioning

confidence: 99%

Enhanced systematic design of a voltage controlled oscillator using a two-step optimization methodology

et al. 2018

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In this paper a design strategy based on bottomup design methodologies is used in order to systematically design a voltage controlled oscillator. The methodology uses two computer-aided design tools: AIDA, a multi-objective multiconstraint circuit optimization tool, and SIDe-O, a tool that characterizes and optimizes integrated inductors with high accuracy (around 1% when compared to electromagnetic simulations). By using such tools, the difficult trade-offs inherent to radio-frequency circuits can be explored efficiently and accurately. Furthermore, with the capability that AIDA has at considering process parameter variations during the optimization, the resulting methodology is able to obtain truly robust circuit designs.

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Modeling of Spiral Inductors

Cited by 20 publications

References 6 publications

A Multilevel Bottom-Up Optimization Methodology for the Automated Synthesis of RF Systems

A Multilevel Bottom-Up Optimization Methodology for the Automated Synthesis of RF Systems

Fully Inkjet Printed RF Inductors and Capacitors Using Polymer Dielectric and Silver Conductive Ink With Through Vias

Enhanced systematic design of a voltage controlled oscillator using a two-step optimization methodology

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