DOI: 10.22215/etd/2015-11004
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Modeling of Residual Stress Fields and Their Effects on Fatigue Crack Growth

Abstract: Fatigue Crack Growth (FCG) is a deleterious physical phenomenon in engineering materials, which is intensified by the presence of tensile Residual Stress Fields (RSF), while compressive RSF has been shown to delay the FCG phenomenon. However, several challenges make it difficult to fully incorporate the beneficial effects of compressive RSF into the design process in aerospace and other engineering industries. Chapter: Results and Discussion for the model of the Fatigue Crack Growth in

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