Modeling of planar inductors with non-uniform flux distribution and non-linear permeability for high-density integration

Li, Qiang; Su, Yipeng; Mu, Mingkai; Lee, Fred C.; Gilham, David

doi:10.1109/apec.2012.6165941

Cited by 11 publications

(4 citation statements)

References 20 publications

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“…The accuracy of this numerical technique has been established. The numerical inductance model is proposed for the singlephase inductor with non-uniform flux, and its accuracy has been verified by measurement in [18]. In the following section, the FEA simulation is extended to cover the inductance as well as the core loss modeling for the two-phase coupled inductor.…”

Section: Introductionmentioning

confidence: 99%

FEA modeling of the low profile coupled inductor with non-uniform flux distribution

Lee

2013

2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)

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The high frequency 3-dimension (3D) integrated Point-of-Load (POL) module has been demonstrated with more than 800W/in 3 power density, in which the low profile inductor serves as the substrate carrying the active components. The performance of the magnetic substrate can be further improved by inversed coupling two single-phase inductors. However, the non-uniform distributed flux and permeability in the low profile coupled inductor, raises some new challenges for its inductance and core loss modeling. The accuracy of the conventional reluctance and core loss model, which usually assume uniform flux and core loss density in the core, are questionable. Therefore, the Finite Element Analysis (FEA) simulation tool is used to develop the inductance and core loss models. With these FEA models, the coupled inductor substrates are designed and evaluated for Multi-MHz two-phase 3D integrated POL modules. The impact of the inversed coupling on the magnetic performance of the inductor substrate is also discussed. The comparison between coupled and non-coupled inductors reveals that the inversed coupling can reduce both the core volume and core loss by 40%. The analytical results are verified by the experimental data.

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Section: Introductionmentioning

confidence: 99%

FEA modeling of the low profile coupled inductor with non-uniform flux distribution

Lee

2013

2013 Twenty-Eighth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)

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“…The aim of this work is to propose a simple design method based on 2D finite-element method (FEM) that notably links together electromagnetic (EM) and thermal aspects, including geometric optimization as well. Various modeling methods exist, especially for toroidal and planar cores [24]- [26] but seldom for PCB-integrated inductors [27], [28]. While 3D FEM is usually used for non-PCB inductor design, 2D FEM is preferred in this work so as to optimize a PCB-integrated device.…”

Section: Introductionmentioning

confidence: 99%

Design Method of PCB Inductors for High-Frequency GaN Converters

Chafi

Idir

Videt

et al. 2021

IEEE Trans. Power Electron.

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HAL is a multi-disciplinary open access archive for the deposit and dissemination of scientific research documents, whether they are published or not. The documents may come from teaching and research institutions in France or abroad, or from public or private research centers. L'archive ouverte pluridisciplinaire HAL, est destinée au dépôt et à la diffusion de documents scientifiques de niveau recherche, publiés ou non, émanant des établissements d'enseignement et de recherche français ou étrangers, des laboratoires publics ou privés.

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“…The characteristtics of the LTCC ferrite tape is explored detailly in [137]. Li et al [136] proposed several models to calculate inductance for the LTCC inductor. A numerical model is proposed in [138] and an analytical model is proposed in [139] to calculate the core loss.…”

Section: Ltcc Integration Technologymentioning

confidence: 99%

“…CPES has conducted a series of studies for 3D POL integration using the low profile LTCC inductors as a substrate [128]- [136]. The use of low profile inductors allows for more efficient use of space when integrated with the active devices.…”

Section: Ltcc Integration Technologymentioning

confidence: 99%

Review of State-of-the-Art Integration Technologies in Power Electronic Systems

Wang¹

2017

CPSS TPEA

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Modeling of planar inductors with non-uniform flux distribution and non-linear permeability for high-density integration

Cited by 11 publications

References 20 publications

FEA modeling of the low profile coupled inductor with non-uniform flux distribution

FEA modeling of the low profile coupled inductor with non-uniform flux distribution

Design Method of PCB Inductors for High-Frequency GaN Converters

Review of State-of-the-Art Integration Technologies in Power Electronic Systems

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