Plasma Science and Technology - Basic Fundamentals and Modern Applications 2019
DOI: 10.5772/intechopen.77512
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Modeling of Novel Plasma-Optical Systems

Abstract: This is the review of the current status an ongoing theoretical, simulations and some experimental researches of the novel plasma dynamical devices based on the axialsymmetric cylindrical electrostatic plasma lens (PL) configuration and the fundamental plasma-optical principles of magnetic electron isolation and equipotentialization magnetic field lines. The crossed electric and magnetic fields plasma lens configuration provides us with the attractive and suitable method for establishing stable plasma discharg… Show more

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“…Despite this drawback, the granular sulfur-based TMD layers are predicted to have higher energy barriers for Cu diffusion compared to the other class of granular 2D materials and traditional TaN layers. ,, These predictions are supported by a recent study on low-temperature plasma-sulfurized tantalum (TaS x ) layers, showing that TaS x serves as a better barrier and liner than a TaN/Ta system . However, there is a catch: plasma-assisted growth processes can potentially degrade the surrounding dielectric . Hence, for the fabrication of future microelectronic interconnects, a reliable process enabling wafer-scale plasma-free growth of 2D materials is needed.…”
Section: Introductionmentioning
confidence: 96%
“…Despite this drawback, the granular sulfur-based TMD layers are predicted to have higher energy barriers for Cu diffusion compared to the other class of granular 2D materials and traditional TaN layers. ,, These predictions are supported by a recent study on low-temperature plasma-sulfurized tantalum (TaS x ) layers, showing that TaS x serves as a better barrier and liner than a TaN/Ta system . However, there is a catch: plasma-assisted growth processes can potentially degrade the surrounding dielectric . Hence, for the fabrication of future microelectronic interconnects, a reliable process enabling wafer-scale plasma-free growth of 2D materials is needed.…”
Section: Introductionmentioning
confidence: 96%