Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module

Le, Van-Nhat; Benabou, Lahouari; Tao, Quang Bang; Etgens, V. H.

doi:10.1016/j.ijsolstr.2016.12.003

Cited by 36 publications

(15 citation statements)

References 48 publications

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“…Le et al. 13 proposed an individual three-dimensional microstructure-informed model for reproducing the fatigue crack in the solder joint of an electronic module. Their results accurately showed the crack propagation at the grain boundaries of the solder material.…”

Section: Introductionmentioning

confidence: 99%

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Ghaderi

Pourmahdavi

Samavatian

et al. 2018

Proceedings of the Institution of Mechanical Engineers, Part L:

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In this work, the combination of vibration loading and thermal cycle effects on the fatigue properties of a solder joint in a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) discrete was investigated. The fatigue mechanism under each loading mode was individually analyzed, and then according to the incremental damage superposition approach, the simultaneous effects were thoroughly studied. Under thermal cycling, the creep behavior of the solder is linked to the fatigue life. In fact, the creep accumulated strain in each thermal cycle has a straight relation to the failure time of solder joint. The origin of stress/strain in the assembly is owing to the sharp difference between coefficients of thermal expansions of the components in the electronic package. Regarding the vibration loading, the root mean square of peeling stress as a widely acceptable failure indicator was used to evaluate the vibration effects on the fatigue life. It is determined that the maximum stress is concentrated at the corner of solder layer. This result was similar to the outcomes of thermal cycling. The results also indicated that the combination of thermal and mechanical loadings accelerates the failure of the solder joint of the power MOSFET. Furthermore, the experimental and simulation studies showed similar results and approved the crack initiation at the corner of solder layer.

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Section: Introductionmentioning

confidence: 99%

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Ghaderi

Pourmahdavi

Samavatian

et al. 2018

Proceedings of the Institution of Mechanical Engineers, Part L:

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show abstract

“…Furthermore, it is essential to establish an adaptive microstructure coarsening model to predict such coarsening behaviors in SnAgCu solder joints. In particular, for the micro-joints in advanced packages, Ag 3 Sn coarsening is anticipated to become more complicated, due to faster variations of the solder composition, higher thermally induced stresses, and stronger cross-interactions between different metal pads [27,28].…”

Section: Introductionmentioning

confidence: 99%

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints

et al. 2018

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As solder joints are being scaled down, intermetallic compounds (IMCs) are playing an increasingly critical role in the reliability of solder joints, and thereby an in-depth understanding of IMCs microstructure evolutions in micro-joints is of great significance. This study focused on coarsening behaviors of Ag3Sn compounds in Sn-3.0Ag-0.5Cu (SAC305) micro-joints of flip chip assemblies using thermal shock (TS) tests. The results showed that the Ag3Sn compounds grew and rapidly coarsened into larger ones as TS cycles increased. Compared with such coarsening behaviors during thermal aging, TS exhibited a significantly accelerating influence. This predominant contribution is quantitatively determined to be induced by strain-enhanced aging. Moreover, based on observations for Ag3Sn microstructure evolutions during TS cycling, one particular finding showed that there are two types of coarsening modes (i.e., Ostwald ripening and Necking coalescence) co-existing in the Ag3Sn coarsening process. The corresponding evolutions mechanism was elucidated in a combination of simulative analysis and experimental validation. Furthermore, a kinetic model of the Ag3Sn coarsening was established incorporating static aging and strain-enhanced aging constant, the growth exponent (n) was calculated to be 1.70, and the predominant coarsening mode was confirmed to be the necking coalescence.

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“…CZM is considered to be one of the most effective methods to simulate and predict the structural degradation process [21]. At present, existing applications include two-dimensional simulation of the overall structure of the degraded solder layer of power devices [22], crystal level simulation of the substrate solder layer [23], integrated circuit interconnect structure integrity analysis [24], and cracks in the post-process laminar structure [25], etc. It is usually used to study the degradation behaviors such as delamination, fracture and debonding under static, dynamic and periodic loads [26].…”

Section: A Constitutive Relation Of Czmmentioning

confidence: 99%

Research on IGBT Bonding Wires Crack Propagation at the Macro and Micro Scales

et al. 2021

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Under the action of a complex and harsh working environment, the damage of the IGBT power module's packaging interconnection structure is the primary failure mode. The crack propagation and the bonding interface and the bond point shedding in the bonding wires will seriously affect the device's electrical interconnection function and heat dissipation ability, resulting in its performance degradation and failure. In this work, the formulation and application of a multiscale approach combined with a cohesive zone model (CZM) were proposed to investigate IGBT bonding wires' crack propagation. Firstly, the cohesive force model's principle considering fatigue damage accumulation is analyzed, and the degradation multiscale simulation method of the critical structure of the power module is studied. Secondly, further research on IGBT bonding wires' degradation behavior is carried out based on the macro and micro scales. The IGBT power module key package structure's defect evolution model is established to analyze the damage evolution process of the critical package structure. Finally, the accuracy of the model is verified by the experiment analysis. Such a multiscale, mechanism-based cohesive zone model offers a promising approach for modeling and understanding the rate-dependent fracture of IGBT bonding wire crack evolution.

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Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module

Cited by 36 publications

References 48 publications

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints

Research on IGBT Bonding Wires Crack Propagation at the Macro and Micro Scales

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