“…The bonding process is a combination of the flattening of the asperities at the interface (intimate contact development [11][12][13]), and the diffusion of polymer chains across the interface (autohesion or healing [14][15][16]). Other physical processes occur simultaneously during the process such as changes in crystallinity [5,17,18], void content [9,19], residual stress [20,21] and degradation [22,23] -all of which are sensitive to the specific temperature history. Optimisation of the quality of the resulting composite is non-trivial due to the multi-faceted nature of the process [22,24,25].…”