The patterning characteristics of matrix projection exposure using an analog liquid crystal display (LCD) panel in place of a reticle were investigated, in particular for oblique patterns. In addition, a new method for fabricating practical thick resist molds was developed. At first, an exposure system fabricated in past research was reconstructed. Changes in the illumination optics and the projection lens were the main improvements. Using fly's eye lenses, the illumination light intensity distribution was homogenized. The projection lens was changed from a common camera lens to a higher-grade telecentric lens. In addition, although the same metal halide lamp was used as an exposure light source, the central exposure wavelength was slightly shortened from 480 to 450 nm to obtain higher resist sensitivity while maintaining almost equivalent contrast between black and white. Circular and radial patterns with linewidths of approximately 6 mm were uniformly printed in all directions throughout the exposure field owing to these improvements. The patterns were smoothly printed without accompanying stepwise roughness caused by the cell matrix array. On the bases of these results, a new method of fabricating thick resist molds for electroplating was investigated. It is known that thick resist molds fabricated using the negative resist SU-8 (Micro Chem) are useful because very high aspect patterns are printable and the side walls are perpendicular to the substrate surfaces. However, the most suitable exposure wavelength of SU-8 is 365 nm, and SU-8 is insensitive to light of 450 nm wavelength, which is most appropriate for LCD matrix exposure. For this reason, a novel multilayer resist process was proposed, and micromolds of SU-8 of 50 mm thickness were successfully obtained. As a result, feasibility for fabricating complex resist molds including oblique patterns was demonstrated.