Abstract:End of range ͑EOR͒ defects are the most commonly observed defects in ultrashallow junction devices. They nucleate at the amorphous-crystalline interface upon annealing after amorphization due to ion implantation. EOR defects range from small interstitial clusters of a few atoms to ͕311͖ defects and dislocation loops. They are extrinsic defects and evolve during annealing. Li and Jones ͓Appl. Phys. Lett., 73, 3748 ͑1998͔͒ showed that ͕311͖ defects are the source of the projected range dislocation loops. In this… Show more
“…However, the density of loops as predicted by the model is too low for these experiments, but is correct qualitatively. Figure 11 shows the experimental and simulation results for the defect evolution at 750°C for a Si + 1x10 15 cm -2 20 keV implant [21] and for a Si + 2x10 15 cm -2 40 keV implant [8]. In addition, figure 10 shows the improvements by the loop model to predict the interstitial retention in extended defects for longer anneals.…”
Section: Resultsmentioning
confidence: 99%
“…R DL is the average radius of the dislocation loops [8] defined by: R DL is the average radius of the dislocation loops [8] defined by:…”
The simulation of deep-submicron silicon-device manufacturing processes relies on predictive models for extended defect clusters. For submicroscopic interstitial clusters and {311} defects, an efficient and highly accurate model for process simulation has been developed and calibrated recently [1]. This model combines equations for three small interstitial clusters and two moments for {311} defects. In this work, we extend this model to include dislocation loops and to reproduce a greatly increased range of experimental data, including thermal annealing of end-of-range defects after amorphizing implants.
“…However, the density of loops as predicted by the model is too low for these experiments, but is correct qualitatively. Figure 11 shows the experimental and simulation results for the defect evolution at 750°C for a Si + 1x10 15 cm -2 20 keV implant [21] and for a Si + 2x10 15 cm -2 40 keV implant [8]. In addition, figure 10 shows the improvements by the loop model to predict the interstitial retention in extended defects for longer anneals.…”
Section: Resultsmentioning
confidence: 99%
“…R DL is the average radius of the dislocation loops [8] defined by: R DL is the average radius of the dislocation loops [8] defined by:…”
The simulation of deep-submicron silicon-device manufacturing processes relies on predictive models for extended defect clusters. For submicroscopic interstitial clusters and {311} defects, an efficient and highly accurate model for process simulation has been developed and calibrated recently [1]. This model combines equations for three small interstitial clusters and two moments for {311} defects. In this work, we extend this model to include dislocation loops and to reproduce a greatly increased range of experimental data, including thermal annealing of end-of-range defects after amorphizing implants.
“…There are also some models to simulate the growth and ripening of DLs [11] without considering {3 1 1}-defects. Concerning the key point of the transformation of {3 1 1}-defects into DLs, it has been treated in two different ways: one assuming a transformation rate that does not depend on defect size [12] and another considering a fixed threshold size for a {3 1 1}-defect to unfault into DL [9]. The first one has proved to properly describe the nucleation and evolution of DL in amorphizing implants [12] but, as no size-dependence is considered, it would incorrectly predict DL formation also for low-dose implants, in contradiction with experiments [1,3].…”
Section: Introductionmentioning
confidence: 99%
“…Concerning the key point of the transformation of {3 1 1}-defects into DLs, it has been treated in two different ways: one assuming a transformation rate that does not depend on defect size [12] and another considering a fixed threshold size for a {3 1 1}-defect to unfault into DL [9]. The first one has proved to properly describe the nucleation and evolution of DL in amorphizing implants [12] but, as no size-dependence is considered, it would incorrectly predict DL formation also for low-dose implants, in contradiction with experiments [1,3]. In contrast, the second one can be used for both low and high doses, elucidating whether or not DLs nucleate and correctly describing the overall evolution of the {3 1 1} and DL populations [9].…”
“…Particularly in Si, there has been substantial experimental [2][3][4][5][6][7] and theoretical [8][9][10][11][12][13][14] work aimed at unraveling both the structure and properties of defects and their interaction with dopants. It is now well accepted that ion implantation generates a large self-interstitial (I) supersaturation, and that Is tend to aggregate in defect clusters that follow an Ostwald ripening (OR) process driven by the reduction of defect formation energies [8].…”
Ultrafast laser annealing of ion implanted Si has led to thermodynamically unexpected large {001} self-interstitial loops, and the failure of Ostwald ripening models for describing self-interstitial cluster growth. We have carried out molecular dynamics simulations in combination with focused experiments in order to demonstrate that at temperatures close to the melting point, self-interstitial rich Si is driven into dense liquidlike droplets that are highly mobile within the solid crystalline Si matrix. These liquid droplets grow by a coalescence mechanism and eventually transform into {001} loops through a liquid-to-solid phase transition in the nanosecond time scale.
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