2010
DOI: 10.1088/0960-1317/20/12/125001
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Modeling, design, fabrication and characterization of a micro Coriolis mass flow sensor

Abstract: This paper discusses the modeling, design and realization of micromachined Coriolis mass flow sensors. A lumped element model is used to analyze and predict the sensor performance. The model is used to design a sensor for a flow range of 0-1.2 g h −1 with a maximum pressure drop of 1 bar. The sensor was realized using semi-circular channels just beneath the surface of a silicon wafer. The channels have thin silicon nitride walls to minimize the channel mass with respect to the mass of the moving fluid. Special… Show more

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Cited by 71 publications
(110 citation statements)
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“…Details on the fabrication process and sensor detection principles can be found in [11,12]. Both the thermal and Coriolis sensors consist of a silicon nitride tube with a wall thickness of roughly 1 μm.…”
Section: Mems Sensormentioning
confidence: 99%
“…Details on the fabrication process and sensor detection principles can be found in [11,12]. Both the thermal and Coriolis sensors consist of a silicon nitride tube with a wall thickness of roughly 1 μm.…”
Section: Mems Sensormentioning
confidence: 99%
“…Details can be found in [4]. To protect the relatively fragile Coriolis tube a glass cover is glued on top of the chip.…”
Section: Chip and Packagingmentioning
confidence: 99%
“…This places strong demands on the detection part which is done using electrostatic comb structures [4]. Here displacement of the tube causes a change in capacitance that is transformed into a voltage change.…”
Section: Electronicsmentioning
confidence: 99%
“…Transducer structures can be integrated in close proximity to the fluid using suitable materials. Commonly used actuation and read-out methods that can be combined in this platform are thermal, Lorentz force and electrostatic actuation Haneveld et al 2010;Wiegerink et al 2011;Droogendijk et al 2012) and optical, resistive and capacitive read-out (Haneveld et al 2008;Lötters et al 2013;Haneveld et al 2009). The fabrication uses process steps that can easily be transferred to a MEMS foundry, enabling easy upscaling.…”
Section: Introductionmentioning
confidence: 99%