2005
DOI: 10.1016/j.sna.2004.05.036
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Modeling, design and fabrication of a triple-layered capacitive pressure sensor

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Cited by 51 publications
(24 citation statements)
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“…For example, for CMUTs, this deflection determines the capacitance change and thus the electromechanical coupling coefficient which characterizes the transducer bandwidth and sensitivity [7], [10]. For capacitive pressure sensors, the deflection of the flexible microplate as a result of both the electrostatic force and the pressure determines the capacitance variation and thus the sensor sensitivity and nonlinearity [2], [11]. If the applied voltage increases up to a critical value beyond which the mechanical restoring force of the microplate can no longer balance the electrostatic force, the flexible microplate will collapse and make contact with the rigid microplate.…”
mentioning
confidence: 99%
“…For example, for CMUTs, this deflection determines the capacitance change and thus the electromechanical coupling coefficient which characterizes the transducer bandwidth and sensitivity [7], [10]. For capacitive pressure sensors, the deflection of the flexible microplate as a result of both the electrostatic force and the pressure determines the capacitance variation and thus the sensor sensitivity and nonlinearity [2], [11]. If the applied voltage increases up to a critical value beyond which the mechanical restoring force of the microplate can no longer balance the electrostatic force, the flexible microplate will collapse and make contact with the rigid microplate.…”
mentioning
confidence: 99%
“…These equations can further be cast in a matrix form which can be solved using any general numerical equation solver. An iteration procedure is established by taking the corresponding linear solution of lateral slope as the initial values [15]. These are substituted into the second set of simultaneous equations to solve for a primary solution for the radial force resultant, {S r }.…”
Section: Finite Difference Numerical Methodsmentioning
confidence: 99%
“…Among them, the former ([Poly-Si/Si/Poly-Si]) is nearly monolithic simulating a single-layered plate (NMP), while the latter represents a typical layered plate (TLP). The material properties including Young's moduli and Poisson's ratios for the layers are listed in Table 1 which essentially follow those of Zhou, et al [15]. All the remaining physical parameters of the problems were adopted from those employed by Sheplak and Dugundji [5] and Wang, et al [8].…”
Section: Numerical Remarksmentioning
confidence: 99%
“…Among them, the former (L a plate) simulates a nearly monolithic plate (NMP), while the latter represents a typical layered plate (TLP). The material properties including Young's moduli and Poisson's ratios for the layers are given in Table 1, which essentially follows those employed by Zhou, et al [13]. The applied voltage is taken to be V=1, 5, 10, 20, and 30 (Volt) and piezoelectric constant considered by Wang, et al.…”
Section: Numerical Remarksmentioning
confidence: 99%