Modeling and Simulation of SU-8 Thick Photoresist Lithography

Zhou, Zai-Fa; Huang, Qing-An

doi:10.1007/978-981-10-5945-2_3

Cited by 1 publication

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“…Second, despite bevelling of the wafer edge to avoid sharp edges which can cause resistance to spreading [22], the spin coating process can lead to the accumulation of fluid at the wafer edge [23]-this is commonly called an 'edge bead'. This effect is all the more pronounced for higher viscosity products which are spin-coated at low spin speeds to form 'thick' liquid films, such as thick photoresists [24][25][26]-something that was, in fact, pointed out sometime ago [27]. Such edge beads are highly undesirable as they have three main detrimental effects.…”

Section: Introductionmentioning

confidence: 99%

The limits of edge bead planarization and surface levelling in spin-coated liquid films

Arscott

2020

J. Micromech. Microeng.

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A model is presented here to predict fluid reflow in a viscous liquid film having time-dependent physical properties. The model is applied to the practical example of the reflow planarization (surface levelling) of 'edge bead' features resulting from the spin coating process. During the reflow planarization of edge beads, the physical properties (surface tension, density and viscosity) of the spin-coated liquid can change over time for several reasons e.g. temperature change, solvent loss, and chemical reaction. The model is compared to experimental findings obtained using two spin-coated viscous liquid films: a drying photoresist (SU-8) and a curing elastomer (polydimethylsiloxane/PDMS). The former reveals the competition between reflow planarization and solvent loss-the latter reveals competition between reflow planarization and polymerization. It is demonstrated that the changing physical properties of the spincoated viscous liquid, especially the viscosity which can change by orders of magnitudes during these processes, impose limitations on the ultimate achievable practical planarization of the film.

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Section: Introductionmentioning

confidence: 99%

The limits of edge bead planarization and surface levelling in spin-coated liquid films

Arscott

2020

J. Micromech. Microeng.

View full text Add to dashboard Cite

show abstract

Modeling and Simulation of SU-8 Thick Photoresist Lithography

Cited by 1 publication

References 94 publications

The limits of edge bead planarization and surface levelling in spin-coated liquid films

The limits of edge bead planarization and surface levelling in spin-coated liquid films

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