Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)
DOI: 10.1109/eptc.2003.1271526
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Modeling and simulation of printed circuit board drop test

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Cited by 38 publications
(27 citation statements)
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“…Note that the accelerometer attached on the PCB shown in Fig. 7 was not required during the measurement by using the high-speed camera, and the weight of the sensor will influence the experimental results [7]. The camera has the ability to record up to 4500 frames/s for immediate playback so that the image storage of extremely rapid events, such as those of drop tests, can be accurately carried out.…”
Section: Methodsmentioning
confidence: 99%
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“…Note that the accelerometer attached on the PCB shown in Fig. 7 was not required during the measurement by using the high-speed camera, and the weight of the sensor will influence the experimental results [7]. The camera has the ability to record up to 4500 frames/s for immediate playback so that the image storage of extremely rapid events, such as those of drop tests, can be accurately carried out.…”
Section: Methodsmentioning
confidence: 99%
“…Furthermore, a hybrid method developed in Ref. [7] is used in this simulation. Note that this method simulates only the flip chip on board (FCOB) assembly, including the PCB and silicon chips as shown in Fig.…”
Section: Geometry Modelmentioning
confidence: 99%
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“…This way the inertia of the component board at the shock impact makes the board bend between the supports and the modes and frequencies of vibration determined by the component board. This is an approach adopted by a few research groups [27,[56][57][58][59] as well as the widely employed JESD22-B111 board-level drop test standard for portable applications [12].…”
Section: Methods Of Shock Impact Testingmentioning
confidence: 99%
“…The problem in the edge effects was analyzed by Aleck (1949), the elastic one contained in the solutions (Lee and Jasiuk, 1991), and the problem was discussed with finite element method by Lau (1989). From a few concrete reports by using finite element analysis (FEA), PCBs had been represented by isotropic models (Yang et al, 2000;Wu et al, 2002;Wang et al, 2003). However, the mechanical properties of the laminate PCBs are different in the orthogonal directions with the plane of PCBs (Moore and Jarvis, 2002).…”
Section: Introductionmentioning
confidence: 99%