Modeling and Simulation of Fast Neutral Beam Sources for Materials Processing

Economou, Demetre J.

doi:10.1002/ppap.200900005

Cited by 8 publications

(4 citation statements)

References 63 publications

(60 reference statements)

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“…Etching of high aspect ratio patterns with plasmas is susceptible to sidewall charging. In order to avoid the aforementioned problems related to the presence of charge and (V)UV radiation, etching with energetic neutral beams (NB) has been proposed for nanometre-scale device fabrication [1][2][3][4][5][6][7][8]. Different approaches used for energetic neutral beam generation include laser detonation [1] as well as surface [2,9] and volume [10] neutralization of ion beams.…”

Section: Introductionmentioning

confidence: 99%

Extraction and neutralization of positive and negative ions from a pulsed electronegative inductively coupled plasma

Marinov¹,

Otell²,

Bowden³

et al. 2015

Plasma Sources Sci. Technol.

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Almost electron-free (ion-ion) plasmas can be transiently formed during the afterglow phase of pulsed plasmas in electronegative gases. In ion-ion plasmas, both positive and negative ions can be extracted which makes them advantageous for a number of applications. In this paper, we investigate the extraction and acceleration of positive and negative ion beams from a pulsed inductively coupled plasma in SF 6 . The plasma is bounded by two electrodes biased synchronously with the discharge modulation. It is shown that when a DC bias voltage is applied during the afterglow phase, positive/negative ions are accelerated in a positive/ negative space charge sheath formed in front of one of the electrodes. The energy of extracted ions closely follows the amplitude of the applied bias voltage (25-150 V) and the peak beam current density reaches 2 A m −2 . With a view to using the described system as a source of energetic neutral beams for low damage material processing, simultaneous extraction and surface neutralization of positive and negative ions using an extraction electrode with high aspect ratio apertures is investigated.

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Section: Introductionmentioning

confidence: 99%

Extraction and neutralization of positive and negative ions from a pulsed electronegative inductively coupled plasma

Marinov¹,

Otell²,

Bowden³

et al. 2015

Plasma Sources Sci. Technol.

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“…The latter can be achieved either by pulsed plasmas [ 64 , 65 ], which can produce and inject negative ions into the valleys, or by DC-augmented capacitive coupled plasmas [ 53 , 66 ], which can produce and inject narrow angle and high energy electrons into the valleys. An alternative to eliminate surface charging is by neutral beam etching [ 67 , 68 , 69 ].…”

Section: Discussionmentioning

confidence: 99%

Roughness Evolution and Charging in Plasma-Based Surface Engineering of Polymeric Substrates: The Effects of Ion Reflection and Secondary Electron Emission

2018

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The interaction of plasma with polymeric substrates generates both roughness and charging on the surface of the substrates. This work, toward the comprehension and, finally, the control of plasma-induced surface roughness, delves into the intertwined effects of surface charging, ion reflection, and secondary electron-electron emission (SEEE) on roughness evolution during plasma etching of polymeric substrates. For this purpose, a modeling framework consisting of a surface charging module, a surface etching model, and a profile evolution module is utilized. The case study is etching of a poly(methyl methacrylate) (PMMA) substrate by argon plasma. Starting from an initial surface profile with microscale roughness, the results show that the surface charging contributes to a faster elimination of the roughness compared to the case without charging, especially when ion reflection is taken into account. Ion reflection sustains roughness; without ion reflection, roughness is eliminated. Either with or without ion reflection, the effect of SEEE on the evolution of the rms roughness over etching time is marginal. The mutual interaction of the roughness and the charging potential is revealed through the correlation of the charging potential with a parameter combining rms roughness and skewness of the surface profile. A practical implication of the current study is that the elimination or the reduction of surface charging will result in greater surface roughness of polymeric, and generally dielectric, substrates.

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“…However, for the second case for a pressure 300 mbar, the deviations between the two models were 20% in the bulk region, while they were around 30% in the wall region. Several works on low pressure plasmas (less than 100 mbar) use the thermal nonequilibrium models (Ye et al, Johannes et al, Panagopoulos et al, and Economou). In the present work, the gas pressure is 1000 mbar.…”

Section: Experimental Setup and Measurementsmentioning

confidence: 99%

Flow and temperature patterns in an inductively coupled plasma reactor: Experimental measurements and CFD simulations

Punjabi

Sahasrabudhe²,

Ghorui³

et al. 2014

AIChE Journal

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Measurements of temperature patterns in an inductively coupled plasma (ICP) have been carried out experimentally. Plasma torch was operated at different RF powers in the range of 3-14 kW at near atmospheric pressure and over a wide range of sheath gas flow rate (3-25 lpm). Measurements were made at five different axial positions in ICP torch. The chordal intensities were converted into a radial intensity profile by Abel Inversion technique. Typical radial temperature profile shows an off-axis temperature peak, which shifts toward the wall as the power increases. Temperatures in the range of 6000-14,000 K were recorded by this method. The temperature profiles in the plasma reactor were simulated using computational fluid dynamics (CFD). A good agreement was found between the CFD predictions of the flow and temperature pattern with those published in the literature as well as the temperature profiles measured in the present work.

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Modeling and Simulation of Fast Neutral Beam Sources for Materials Processing

Cited by 8 publications

References 63 publications

Extraction and neutralization of positive and negative ions from a pulsed electronegative inductively coupled plasma

Extraction and neutralization of positive and negative ions from a pulsed electronegative inductively coupled plasma

Roughness Evolution and Charging in Plasma-Based Surface Engineering of Polymeric Substrates: The Effects of Ion Reflection and Secondary Electron Emission

Flow and temperature patterns in an inductively coupled plasma reactor: Experimental measurements and CFD simulations

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