Modeling and optimization of material removal influenced by sliding velocity in polishing

Cheng, Fan; Zhang, Lei; Zhao, Qizhi; Zhao, Jun; Zhao, Jun; Sun, Lining

doi:10.1177/0954405418774589

Cited by 8 publications

(4 citation statements)

References 23 publications

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“…In the first measurement region, the material removal on the adjacent two paths caused by the rotation of the polishing tool is superimposed. According to the removal profile of a rotating polishing tool, 30 after the superposition of two profiles, the difference between the maximum removal rate and the minimum removal rate becomes smaller. Therefore, the PT value of this part is smaller and the fluctuation of the profile is small.…”

Section: Experiments and Discussionmentioning

confidence: 99%

Polishing path generation for physical uniform coverage of the aspheric surface based on the Archimedes spiral in bonnet polishing

Zhao

Zhang

Han

et al. 2019

Proceedings of the Institution of Mechanical Engineers, Part B:

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As a new polishing method, bonnet polishing is suitable for polishing the curved surface due to its advantages in flexibility and adaptability of the polishing tool. In the polishing process, the contact state between the bonnet and the curved surface always changes. The traditional polishing tool path with equal interval will inevitably lead to over-polished areas and unpolished areas. In this article, a new tool path for bonnet polishing, which is called the revised Archimedes spiral polishing path, is proposed to ensure the physical uniform coverage of the curved surface in bonnet polishing. The path generation method is based on the modified tool–workpiece contact model and the pointwise searching algorithm. To prove the effectiveness of the revised path, two aspheric workpieces were polished along the traditional Archimedes spiral polishing path and the revised path, respectively. The roughnesses of the two workpieces are 10.94 and 10 nm, and the profile tolerances are 0.4097 and 0.2037 μm, respectively. The experimental results show that the revised path achieves lower roughness and surface tolerance than the traditional Archimedes path, which indicates that the revised path can achieve uniform physical coverage on the surface.

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Section: Experiments and Discussionmentioning

confidence: 99%

Polishing path generation for physical uniform coverage of the aspheric surface based on the Archimedes spiral in bonnet polishing

Zhao

Zhang

Han

et al. 2019

Proceedings of the Institution of Mechanical Engineers, Part B:

Self Cite

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“…Grinding is a complicated process with a large number of disordered abrasive grains utilized to remove the workpiece material, whose quality is affected by many factors. According to corresponding researches of Xiao and Huang, 19 Sieniawski and Nadolny, 20 and Fan et al, 21 grinding force, feed rate and rotation speed are the key parameters and generally selected as the variables to establish the quality model. While, for complex curved workpieces, the effect of curvature on grinding quality is non-negligible.…”

Section: The Modified Quality Model Based On Vfsmentioning

confidence: 99%

An adaptive parameters adjustment and planning method for robotic belt grinding using modified quality model

Chen

Zhang

2020

Proceedings of the Institution of Mechanical Engineers, Part B:

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As a kind of ﬂexible manufacturing system, the machining quality of a robotic belt grinding system is related to a variety of factors with strong time variation, which easily leads to process fluctuations and affects the final quality. Therefore, it is a great challenge to control the quality precisely during the whole grinding procedure. Focusing on this problem, an adaptive parameters adjustment and planning method for robotic belt grinding using the modified quality model is proposed in this paper. Firstly, the correlation analysis method of grinding parameters in time domain is presented based on an improved-Mahalanobis distance. The response surface methodology (RSM) is utilized to construct the quality prediction model, and furtherly the parameter sensitivity function, which can characterize the influence degree of different parameters on the grinding quality, is introduced to calculate the Mahalanobis distance for improving the accuracy of the correlation analysis method. Secondly, based on the correlation analysis, a conversion method from the old samples into the new samples space is presented using vector field smoothing algorithm (VFS), then the modified grinding quality model can be re-established adopting the new samples. Furtherly, taking the problem of poor robotic response rate into consideration, a multi-parameters collaborative planning method under the smoothness constraint is developed using particle swarm optimization (PSO) algorithm, which can avoid the parameter mutation and improve the process stability. Finally, belt grinding experiments on a curved surface were carried out based on the robotic grinding platform. The results show that the approach can improve the grinding shape accuracy, which verify the effectiveness of the proposed methods.

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“…The particle trajectory was also used to establish the motion model in the planarization process. 19,20 With the motion model, the effects of kinematic variables such as rotational speed and translational speed were investigated. The results show that kinematic variables and wafer size have a great influence on the velocity distribution.…”

Section: Introductionmentioning

confidence: 99%

Profile control processes based on contact types in silicon wafer DSP manufacturing management

Zhu

Zhang³

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part B:

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To reduce the manufacturing cost of integrated circuits, the size of the silicon wafer has become larger, with the diameter increasing from 200 to 450 mm. The large diameter silicon wafer poses challenges to the manufacturing process, as its surface profile is more difficult to control and the planarization process is harder to optimize in mass production. Based on different types of contact, gap adjustment and convex pad dressing methods were proposed in this paper to control the pressure distribution on the wafer, which further influenced the wafer profile. Pressure distributions with different gap values and different pad profiles were explained with contact mechanics and verified by simulations. The simulation results show that a negative gap value and a convex pad profile contribute to the improvement of the pressure uniformity on the wafer. Both methods were then applied in the double-sided planarization (DSP) process of 300 mm silicon wafers. The results from the test run of the DSP process show that wafer flatness is improved with a negative gap value. This indicates that gap adjustment is an effective approach for wafer profile control. In the subsequent mass production of the DSP process, silicon wafers with a global flatness of 120 nm and a site flatness of 21.7 nm were obtained.

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Modeling and optimization of material removal influenced by sliding velocity in polishing

Cited by 8 publications

References 23 publications

Polishing path generation for physical uniform coverage of the aspheric surface based on the Archimedes spiral in bonnet polishing

Polishing path generation for physical uniform coverage of the aspheric surface based on the Archimedes spiral in bonnet polishing

An adaptive parameters adjustment and planning method for robotic belt grinding using modified quality model

Profile control processes based on contact types in silicon wafer DSP manufacturing management

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