Modeling and experimental validation of interconnects with meshed power planes

Li, Y.L.; Bradawy, E.L.; Sharawy, El.; Polka, L.A.; Madrid, Antonio Hernández; Liao, Jiali; Figueroa, D.G.

doi:10.1109/ectc.1997.606321

Cited by 7 publications

(4 citation statements)

References 10 publications

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“…The kink phenomenon in scattering parameter S 22 of FETs/BJTs can be seen frequently in the literature [1][2][3][4]. Up to now, two different origins of the S 22 kink phenomenon in deep sub-micron RF MOSFETs have been reported [5][6].…”

Section: Introductionmentioning

confidence: 99%

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Accurate frequency domain modeling of LTCC solid‐gridded plane structures

Chen

Jancura

Virga

et al. 2003

Micro & Optical Tech Letters

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Shrinkage behavior of a plastic plays a critical role in determining the final dimensions of an injection‐molded part. It is well known that process conditions affect many properties of plastic parts, including shrinkage. This study applies the Taguchi method to systematically investigate the effects of process conditions on the shrinkage (along‐ and across‐the‐flow directions) of three plastics: high‐density polyethylene (HDPE), general‐purpose polystyrene (GPS), and acrylonitrile‐butadiene‐styrene (ABS). The results show that HDPE, a semicrystalline plastic, shrinks more than GPS and ABS, two amorphous materials. The extent of anisotropic shrinkage in the along‐the‐flow and across‐the‐flow directions for HDPE is different from GPS and ABS. More shrinkage occurs in the across‐the‐flow direction of HDPE than in its along‐the‐flow direction. The reverse is true for GPS and ABS. Mold and melt temperatures, along with holding pressure and holding time, are the most significant influences on the shrinkage behaviors of three materials, although the importance of each is different for each plastic. The optimal conditions for reducing shrinkage identified by the Taguchi method are experimentally verified and validated by t‐statistic tests. The prediction matches very well with the experimental value for the along‐the‐flow shrinkage of GPS.

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Section: Introductionmentioning

confidence: 99%

“…The signal propagation and signal coupling behavior between transmission lines and perforated grounds was investigated in [2] and [3]. In [4], the inductance in the presence of three-dimensional mesh structures used for on-chip power supplies was analyzed and ways of designing a power/ ground mesh that reduce inductance were shown.…”

Section: Introductionmentioning

confidence: 99%

Accurate frequency domain modeling of LTCC solid‐gridded plane structures

Chen

Jancura

Virga

et al. 2003

Micro & Optical Tech Letters

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“…The use of flexible printed circuit boards (FPCBs) in electronic devices has been increasing as these devices become thinner and smaller. Meshed ground planes have been adopted in FPCBs for impedance matching and improved flexibility [1][2][3][4][5][6][7][8]. Apertures of meshed ground planes cause an effective dielectric constant change and a roundabout current path that increase the inductance of the ground plane [9].…”

Section: Introductionmentioning

confidence: 99%

Improving Signal Integrity by Reducing Mode Conversion in Differential Pairs on a Meshed Ground in Flexible Printed Circuit Boards

Kam

2022

J Electromagn Eng Sci

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Asymmetry in a differential pair leads to deterioration of signal integrity. Differential pairs on a meshed ground often encounter asymmetry in return current paths. In this paper, we propose an offset mesh as an improved mesh structure that offsets asymmetry between a solid region and an aperture region. The offset mesh mitigates the asymmetry in the conventional mesh structure without additional design elements. The proposed structure has been verified to be effective in reducing mode conversion, intra-pair and inter-pair skews, and characteristic impedance variation in the time and frequency domains. This enables high-density routing of differential pairs.

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“…In recent years, flexible printed circuit (FPC) boards have been increasingly used in electronic devices as these devices become smaller and lighter [1,2]. The dielectric of an FPC is very thin, and the characteristic impedance of its differential transmission lines is lower than the designated value, so the ground (i.e.…”

Section: Introductionmentioning

confidence: 99%

Mitigating differential skew by rotating meshed ground for high-density layout in flexible printed circuits

Wang

Iokibe

Toyota

2020

IEICE Electron. Express

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Asymmetry of differential transmission lines over a meshed ground plane causes differential skew, which leads to signal integrity issues. We measured to evaluate how the angle between the differential transmission lines and meshed ground (the rotation angle) affected differential skew. We also investigated the effect of the lines' position on characteristic impedance and the feasibility of high-density layout of the differential transmission lines, including the bend structure. We found that the differential skew and characteristic impedance are not significantly affected by the position of the differential transmission lines and meshed ground when the rotation angle is set to 30 • , a relatively small value. Measurements showed that our design is effective.

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Modeling and experimental validation of interconnects with meshed power planes

Cited by 7 publications

References 10 publications

Accurate frequency domain modeling of LTCC solid‐gridded plane structures

Accurate frequency domain modeling of LTCC solid‐gridded plane structures

Improving Signal Integrity by Reducing Mode Conversion in Differential Pairs on a Meshed Ground in Flexible Printed Circuit Boards

Mitigating differential skew by rotating meshed ground for high-density layout in flexible printed circuits

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