Modeling and analysis of the material removal depth for stone polishing

Optimization of pre-polishing parameters on a 5-axis milling machine

“…Thus, Tsai et Huang [3] used an empirical approach with Design Of Experiments (DOE) to optimize polishing parameters. Wang et al [13], using a numerical model, demonstrated that the removal material flow rate is mainly influenced by polishing contact pressure. At the same time, roughness and undulation must be controlled.…”

An investigation of the effects of the tool path on the removal of material in polishing

“…Such a model would likely involve the stress distribution arising from the non-conforming contact between the tool and the surface. For the case of elastic tools polishing part surfaces, the assumptions of Hertzian contact stress seem reasonable (Xi and Zhou, 2005;Wang et al, 2009;Roswell et al, 2006;Zhang et al, 2002a,b). If Amorton's wear law applies, and if the relative speed between the tool and the surface is roughly constant within the contact, then both the contact stress distribution and the tool impression function are approximately ellipsoidal.…”

“…It was also reported that vibration had positive effects on polishing-in wafer edge finishing using polishing pad (Kobayashi et al, 2008), polishing microsurfaces with a small tool (Suzuki et al, 2006), polishing with a ball tool (Shiou and Ciou, 2008), magnetic abrasive polishing (Yin and Shinmura, 2004) and polishing with a pointed horn (Hocheng and Kuo, 2002). There were also efforts to establish better understanding of processes in modelling of the surface roughness by Xi and Zhou (2005) and Savio et al (2009) and the depth of removal in fixed abrasive polishing by Wang et al (2009), and finding the effective area in Erf polishing by Zhang et al (2008).…”

Effect of polishing disc compliance on the pressure distribution and material removal

“…The main difference between the free abrasive modelling technique and the fixed abrasive process was (i) the contact between the pad and the workpiece was not relevant in the fixed abrasive process, as there would be always abrasive between them (ii) additional parameters such as slurry concentration was not relevant. 34 In the case of a fixed abrasive process, which is relevant to the present study, Wang et al [78] modelled the material removal considering grain-workpiece interaction. These types of models generally involved three main steps (i) finding pressure distribution between the tool and the workpiece based on contact theory (ii) then the contact pressure distribution was discretized into unit cell, and the indentation depth of each grain at each cell was calculated such that the contact force (contact pressure per unit cell) developed is equal to the applied force at that cell.…”

“…(iii) then the calculations were carried out for the complete experimental time by considering the number of cutting grains participating in each cell and then integrated to get the profile. The flowchart shown in Figure 2.12 implemented by Wang et al [78] describes the overall methodology adopted to model 2D material removal profile.…”