2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2023
DOI: 10.1109/epeps58208.2023.10314953
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Modeling and Analysis of Simultaneous Switching Noise for Full Wafer Scale Chip Core

Hyunwoo Kim,
Seonguk Choi,
Joonsang Park
et al.
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