Modeling, Analysis, and Design for Noise Suppression Using Embedded Planar Capacitors in Multilayered Printed Circuit Boards

A Novel Layer Stack-Up With Free Cavity Resonance for High-Performance Power Noise Suppression

“…2. Dispersion diagram analysis of the unit cell can obtain an accurate corner frequency [8], [39]. Furthermore, the corner frequency can also be estimated by physics-based approximation [8] …”

“…(SMT) capacitors [3]- [7], employing embedded capacitors [8]- [13], adding mushroom electromagnetic bandgap (EBG) structures [14]- [22], etching slots or power islands [23]- [28], designing coplanar EBG structures [29]- [34], terminating or absorbing noise at the edges of the board [35]- [36], attenuating noise with lossy components [37], and selecting the locations of vias [38]. However, these methods have obvious disadvantages.…”

“…It is difficult to achieve high-level noise suppression in both ultralow and ultrahigh frequencies. Discrete capacitors [3]- [7], embedded capacitors [8]- [13], and slots or power islands [23]- [28] have good low-frequency noise mitigation, but they cannot reduce high-frequency noise. Mushroom EBG structures [14]- [22] and coplanar EBG structures [29]- [34] have remarkable high-frequency noise suppression, but they cannot mitigate low-frequency noise especially below ∼500 MHz, even with stopband enhancement methods [17]- [21], [31], [32].…”

A comparative investigation on power noise suppression methods between two blocks in printed circuit boards

“…Then, an embedded planar capacitor can be treated as a single ground plane. Embedded planar capacitors can not only provide significant fast charge to improve the high-speed power delivery performance, but also efficiently mitigate the high-frequency power noise to upgrade signal integrity and reduce EMI [7]. The noise isolation of this method is shown in Fig.…”