Model Quality Evaluation in Semiconductor Manufacturing Process With EWMA Run-to-Run Control

Zheng, Ying; Ling, Dan; Wang, Yanwei; Jang, Shi-Shang; Tao, Bo

doi:10.1109/tsm.2016.2630705

Cited by 15 publications

(6 citation statements)

References 35 publications

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“…From Figure 8, the slopes of straight line parts on the both Mott-Schottky plots show positive values, indicating that the passive film on the surface of Q235 carbon steels is an n-type semiconductor. 31 For n-type semiconductors, the following equation can be applied to interpret Mott-Schottky plot: (7) In equation 7, C sp represents the space electron layer capacitance, E apply represents the applied potential, U fb represents the flat band potential, k is the Boltzmann constant, T is the absolute temperature, e is the electron charge, ε is the dielectric constant of passive film, ε 0 is the permittivity of free space, and N D represents the donor density.…”

Section: Nomentioning

confidence: 99%

The Effects of pH Values on Functional Mechanisms of Nitrite Anions for Q235 Carbon Steels in 0.01 mol L-1 NaNO2-HCl Solutions

Zhou

Zhang

Huang

et al. 2019

J. Braz. Chem. Soc.

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For Q235 carbon steels in 0.01 mol L-1 NaNO 2-HCl solutions with different pH values, the effects of pH values on the functional mechanisms of nitrite anions (NO 2 −) were studied. In the pH 1 and pH 2 solutions, the Q235 steels showed the electrochemical behavior of activation, and uniform corrosion (UC) was the main corrosion type on the Q235 surface. The presence of NO 2 − did not affect the electrochemical behavior and the corrosion type but only accelerated the anodic reaction of Fe oxidation. In the pH 3 and pH 4 solutions, the Q235 steels presented the electrochemical behavior of activation-passivation transition, and intergranular corrosion (IGC) occurred on the Q235 surface. The cathodic reaction of NO 2 − reduction resulted in the transition of electrochemical behavior from activation to passivation and the change of corrosion type from UC to IGC. In the pH 5 and pH 6 solutions, the Q235 steels exhibited the electrochemical behavior of self passivation-pitting, and pitting corrosion (PC) was present on the Q235 surface. The strong oxidability of NO 2 − played a critical role in the formation of γ-Fe 2 O 3 passive film on the Q235 surface under the combined action of Fe 2+ and NO 2 − .

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Section: Nomentioning

confidence: 99%

The Effects of pH Values on Functional Mechanisms of Nitrite Anions for Q235 Carbon Steels in 0.01 mol L-1 NaNO2-HCl Solutions

Zhou

Zhang

Huang

et al. 2019

J. Braz. Chem. Soc.

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“…Semiconductor manufacturing is one of the most important industries in the world [1]. Among the processes of semiconductor manufacturing, quality control is significant for its cost saving and in-time delivery.…”

Section: Introductionmentioning

confidence: 99%

Hybrid Feature Selection for Wafer Acceptance Test Parameters in Semiconductor Manufacturing

Zhang

et al. 2020

IEEE Access

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Wafer acceptance test (WAT) is a key process of semiconductor manufacturing. The collected testing parameters can be used in identification of wafer defects, improvement of product yield, and control of production costs. However, WAT parameters regularly have characteristics such as high dimensions and strong redundancy, which prevent the wafer yield from accurate prediction and effective improvement. To overcome these shortcomings, a hybrid feature selection method is proposed to identify key WAT parameters influencing wafer yields. This method is composed of two stages, i.e. filter selection and wrapper selection. In filter selection, the minimum Redundancy Maximum Relevance (mRMR) filtering parameter pre-screening criterion based on mutual information (MI) is proposed. The relevance between each parameter and the wafer yield value is calculated by MI. At the same time, the criterion of MI is used to measure the redundancy between each parameter to select the minimum redundancy parameters, and reduce feature size for further searches. In wrapper selection, a wrapped key parameter identification model based on genetic algorithm (GA) and deep belief network (DBN) is designed. The coding and optimization of candidate input parameters are realized by GA. The wafer yield prediction error value of the DBN and the weight of the selected features are solved as the fitness function to realize the selection process of the combined parameters. In experiment, both testing data sets and industrial data are used to demonstrate the efficiency of this proposed method.

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“…The above mentioned algorithms have been developed at the wafer stage and are highly reliant on the accuracy of the tools. A Run‐to‐Run (RtR) control algorithm is developed to optimize the process and reduce the influence of deterministic and stochastic disturbances from tools 4–6 . The RtR algorithm is a powerful discrete control algorithm that increases yield and quality based on the produced outputs 7–9 …”

Section: Introductionmentioning

confidence: 99%

Design of a run‐to‐run controller based on discrete sliding‐mode observer

Wang

Pan

Ding

et al. 2020

Asian Journal of Control

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In this study, a run‐to‐run controller based on a discrete sliding‐mode observer (DSMO) is presented for photolithography manufacturing processes. A second‐order DSMO is introduced to estimate the process disturbances caused by tool aging and preventive maintenance. The proposed controller is constructed by applying DSMO estimation to the deadbeat control law and the stable region is discussed. Numerical simulations and an industrial case demonstrated the performance of the proposed algorithm. It is observed that the proposed controller has a superior performance over the exponentially weighted moving average (EWMA) and double EWMA (dEWMA) controller under the first‐order integrated moving average disturbance with shift or drift. This superiority is maintained when the system contains a certain plant‐model mismatch. Moreover, the tolerance of the proposed controller for metrology delay is better than that of the dEWMA controller.

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Model Quality Evaluation in Semiconductor Manufacturing Process With EWMA Run-to-Run Control

Cited by 15 publications

References 35 publications

The Effects of pH Values on Functional Mechanisms of Nitrite Anions for Q235 Carbon Steels in 0.01 mol L-1 NaNO2-HCl Solutions

The Effects of pH Values on Functional Mechanisms of Nitrite Anions for Q235 Carbon Steels in 0.01 mol L-1 NaNO2-HCl Solutions

Hybrid Feature Selection for Wafer Acceptance Test Parameters in Semiconductor Manufacturing

Design of a run‐to‐run controller based on discrete sliding‐mode observer

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