Model-based control in microelectronics manufacturing

Edgar, Thomas F.; Campbell, W.J.; Bode, Christopher

doi:10.1109/cdc.1999.828018

Cited by 16 publications

(6 citation statements)

References 6 publications

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“…First, one must have the ability to observe the machine state. Many researchers have demonstrated how in-line equipment information can be used to assist in process control (May and Spanos, 1993;Bunkofske et al, 1996;Edgar et al, 1999). As discussed above, we have proposed the use of in situ particle monitors (ISPMs) to gauge the machine state.…”

Section: Resultsmentioning

confidence: 96%

Using in-line equipment condition and yield information for maintenance scheduling and dispatching in semiconductor wafer fabs

Sloan

Shanthikumar

2002

IIE Transactions

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Yield is one of the most important measures of manufacturing performance in the semiconductor industry, and equipment condition plays a critical role in determining yield. Researchers and practitioners alike have traditionally treated the problems of equipment maintenance scheduling and production dispatching independently, ignoring how equipment condition may affect different product types or families in different ways. This paper addresses the problem of how to schedule maintenance and production for a multiple-product, multiple-stage production system. The problem is based on the situation found in semiconductor wafer fabrication where the equipment condition deteriorates over time, and this condition affects the yield of the production process. We extend a recently developed Markov decision process model of a single-stage system to account for the fact that semiconductor wafers have multiple layers and thus make repeated visits to each workstation. We then propose a methodology by which the single-stage results can be applied in a multi-stage system. Using a simulation model of a four-station wafer fab, we test the policies generated by the model against a variety of other maintenance and dispatching policy combinations. The results indicate that our method provides substantial improvements over traditional methods and performs better as the diversity of the product set increases. In the scenarios examined, the reward earned using the policies from the combined production and maintenance scheduling method was an average of more than 70% higher than the reward earned using other policy combinations such as a fixed-state maintenance policy and a first-come, first-serve dispatching policy.

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Section: Resultsmentioning

confidence: 96%

Using in-line equipment condition and yield information for maintenance scheduling and dispatching in semiconductor wafer fabs

Sloan

Shanthikumar

2002

IIE Transactions

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“…Most of the attention is being directed at reducing process variation by various means, such as using feedforward control to reduce run-to-run variation (Leang, Shang-Yi, Thomson, Bombay, & Spanos, 1996;Ruegsegger, Wagner, Freedenberg, & Grimard, 1999), or employing model predictive control (Edgar, Campbell & Bode, 1999). Multivariate statistical methods have also been applied with varying degrees of success (e.g., Chen, Wynne, Goulding, & Sandoz, 2000).…”

Section: Process Monitoringmentioning

confidence: 99%

The role of process system engineering (PSE) in integrated circuit (IC) manufacturing

Lewin

Lachman-Shalem

Grosman

2007

Control Engineering Practice

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“…Model predictive control, which has found widespread application in real-time process control, has also been extended to R2R control in [142] and [143], while Hamby et al [144] adopted a probabilistic approach to R2R control.…”

Section: ) Multivariable Modelsmentioning

confidence: 99%

Estimation and Control in Semiconductor Etch: Practice and Possibilities

Ringwood

Lynn

Bacelli

et al. 2010

IEEE Trans. Semicond. Manufact.

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Abstract-Semiconductor wafer etching is, to a large extent, an open-loop process with little direct feedback control. Most silicon chip manufacturers rely on the rigorous adherence to a "recipe" for the various etch processes, which have been built up based on considerable historical experience. However, residue buildup and difficulties in achieving consistent preventative maintenance operations lead to drifts and step changes in process characteristics. This paper examines the particular technical difficulties encountered in achieving consistency in the etching of semiconductor wafers and documents the range of estimation and control techniques currently available to address these difficulties. An important feature of such an assessment is the range of measurement options available if closed-loop control is to be achieved.Index Terms-Closed-loop control, plasma etch, run-to-run control, semiconductor wafer, state estimation, virtual metrology.

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Model-based control in microelectronics manufacturing

Cited by 16 publications

References 6 publications

Using in-line equipment condition and yield information for maintenance scheduling and dispatching in semiconductor wafer fabs

Using in-line equipment condition and yield information for maintenance scheduling and dispatching in semiconductor wafer fabs

The role of process system engineering (PSE) in integrated circuit (IC) manufacturing

Estimation and Control in Semiconductor Etch: Practice and Possibilities

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