Mitigating Test-Induced Yield-Loss by IR-Drop-Aware X-Filling

Shi, Shiling; Holst, Stefan; Wen, Xiaoqing

doi:10.1109/mcsoc60832.2023.00080

2023 IEEE 16th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip (MCSoC) 2023

DOI: 10.1109/mcsoc60832.2023.00080

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Mitigating Test-Induced Yield-Loss by IR-Drop-Aware X-Filling

Shiling Shi,

Stefan Holst,

Xiaoqing Wen

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Mitigating Test-Induced Yield-Loss by IR-Drop-Aware X-Filling

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