Mitigating Cracking from RDL Stress in Glass Substrates with Low-CTE Electrodeposited Copper-Graphene Composites

Molina-Mangual, Christian; Surillo, Emanuel Torres; Nedumthakady, Nithin; Smet, Vanessa

doi:10.1109/ectc51529.2024.00253

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024

DOI: 10.1109/ectc51529.2024.00253

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Mitigating Cracking from RDL Stress in Glass Substrates with Low-CTE Electrodeposited Copper-Graphene Composites

Christian Molina-Mangual,

Emanuel Torres Surillo,

Nithin Nedumthakady

et al.

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Mitigating Cracking from RDL Stress in Glass Substrates with Low-CTE Electrodeposited Copper-Graphene Composites

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