2014 IEEE International Electron Devices Meeting 2014
DOI: 10.1109/iedm.2014.7047034
|View full text |Cite
|
Sign up to set email alerts
|

MIT virtual source GaNFET-RF compact model for GaN HEMTs: From device physics to RF frontend circuit design and validation

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
5
0

Year Published

2018
2018
2024
2024

Publication Types

Select...
4
2

Relationship

0
6

Authors

Journals

citations
Cited by 25 publications
(6 citation statements)
references
References 1 publication
0
5
0
Order By: Relevance
“…The core MVSG model equations calculate the terminal current and non-linear device charges as a function of bias and temperatures as given in [20][21][22]. Figure 1(a) shows a crosssectional schematic representing a p-GaN gate HEMT under study.…”
Section: Adapted Mvsg Modelmentioning
confidence: 99%
See 1 more Smart Citation
“…The core MVSG model equations calculate the terminal current and non-linear device charges as a function of bias and temperatures as given in [20][21][22]. Figure 1(a) shows a crosssectional schematic representing a p-GaN gate HEMT under study.…”
Section: Adapted Mvsg Modelmentioning
confidence: 99%
“…The MIT virtual source GaN (MVSG) HEMT model is one of the compact model coalition (CMC) approved industry standard models for GaN HEMTs [20][21][22]. In our previous work, the MVSG model has been validated for a discrete component of p-GaN gate HEMTs as well as for the circuit block [23].…”
Section: Introductionmentioning
confidence: 99%
“…In order to fully comprehend the experimental characteristics of these devices and to harness their full potential in power-electronic circuit design, thorough understanding of their operation along with a guiding principle for optimal device design is of paramount importance, which necessitates the need to have a fully physics-based analytical compact model for DC-GaN-HEMTs. While several models have been reported for single-channel GaN-HEMTs which includes the state-of-the-art industry standard ASM-GaN-HEMT [12][13][14][15][16][17] and MVSG-GaN [18][19][20] models, only a handful of attempts have been made to model DC-GaN-HEMTs [21][22][23]. Wei et al proposed an analytical model for DC-GaN-HEMTs that only takes care of the electrostatics and as such is only validated against charge densities for both channels at multiple bias conditions [21].…”
Section: Introductionmentioning
confidence: 99%
“…Dasgupta et al [20,21] demonstrated a surface-potentialbased noise model for HEMT devices which has recently been accepted by the compact model coalition (CMC) as an industry-standard advanced simulation program with integrated circuit emphasis model [22]. Another model approved by CMC is the charge-based Massachusetts Institute of Technology virtual source (MVS) model [23], which was initially developed for Si-FETs and then extended for GaN HEMTs. Recently, another charge-based École polytechnique fédérale de Lausanne HEMT model that considered a linear approximation of channel charge as a function of the surface potential was proposed by Jazaeri et al [24,25].…”
Section: Introductionmentioning
confidence: 99%
“…Recently, another charge-based École polytechnique fédérale de Lausanne HEMT model that considered a linear approximation of channel charge as a function of the surface potential was proposed by Jazaeri et al [24,25]. However, none of the previously proposed models [22][23][24][25][26][27][28][29] considered the impact of nanoscale structural parameters on the intrinsic properties of a material such as its bandgap, permittivity, and melting temperature. It has already been demonstrated that the use of these nanoscale parameters predicts the electrical characteristics more accurately than the bulk properties [30].…”
Section: Introductionmentioning
confidence: 99%