Minimizing the Strong Screening Effect of Polyhedral Oligomeric Silsesquioxane Nanoparticles in Hydrogen-Bonded Random Copolymers

Chen, Wei-Cheng; Lin, Ruey-Chorng; Tseng, Shih–Ya; Kuo, Shiao‐Wei

doi:10.3390/polym10030303

Cited by 17 publications

(5 citation statements)

References 36 publications

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“…There are two main approaches to incorporate POSS components in to the PI: physical blending and covalent grafting by surface modification. ,− The most common mode to introduce POSS into PI is covalent bonding. Huang et al reported a novel aminopropyl isobutyl POSS (Am-POSS) with single vertex activity and the POSS–PI composites with permittivity below 2.6 (Figure a).…”

Section: Construction Of Porous Structuresmentioning

confidence: 99%

Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration

Dong,

Wan,

Zha

2024

Chem. Rev.

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The development of microelectronics and large-scale intelligence nowadays promotes the integration, miniaturization, and multifunctionality of electronic and devices but also leads to the increment of signal transmission delays, crosstalk, and energy consumption. The exploitation of materials with low permittivity (low-k) is crucial for realizing innovations in microelectronics. However, due to the high permittivity of conventional interlayer dielectric material (k ∼ 4.0), it is difficult to meet the demands of current microelectronic technology development (k < 3.0). Organic dielectric materials have attracted much attention because of their relatively low permittivity owing to their low material density and low single bond polarization. Polyimide (PI) exhibits better application potential based on its well permittivity tunability (k = 1.1−3.2), high thermal stability (>500 °C), and mechanical property (modulus of elasticity up to 3.0−4.0 GPa). In this review, based on the synergistic relationship of dielectric parameters of materials, the development of nearly 20 years on low-k PI is thoroughly summarized. Moreover, process strategies for modifying low-k PI at the molecular level, multiphase recombination, and interface engineering are discussed exhaustively. The industrial application, technological challenges, and future development of low-k PI are also analyzed, which will provide meaningful guidance for the design and practical application of multifunctional low-k materials.

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Section: Construction Of Porous Structuresmentioning

confidence: 99%

Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration

Dong,

Wan,

Zha

2024

Chem. Rev.

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“…Compared with inorganic materials, organic polymers usually possess lower moduli and poorer thermal stabilities and mechanical properties. The incorporation of inorganic nanoparticles (NPs) nanotubes, or nanosheets (e.g., clay [ 1 , 2 ]), graphene [ 3 , 4 , 5 ], carbon nanotubes [ 6 , 7 , 8 ], or polyhedral oligomeric silsesquioxanes (POSS) [ 9 , 10 , 11 , 12 , 13 ] into a polymer matrix is, however, a relatively simple approach toward improving its mechanical and thermal properties.…”

Section: Introductionmentioning

confidence: 99%

Highly Thermal Stable Phenolic Resin Based on Double-Decker-Shaped POSS Nanocomposites for Supercapacitors

2020

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In this study we incorporated various amounts of a double-decker silsesquioxane (DDSQ) into phenolic/DDSQ hybrids, which we prepared from a bifunctionalized phenolic DDSQ derivative (DDSQ-4OH), phenol, and CH2O under basic conditions (with DDSQ-4OH itself prepared through hydrosilylation of nadic anhydride with DDSQ and subsequent reaction with 4-aminophenol). We characterized these phenolic/DDSQ hybrids using Fourier transform infrared spectroscopy; 1H, 13C, and 29Si nuclear magnetic resonance spectroscopy; X-ray photoelectron spectroscopy (XPS); and thermogravimetric analysis. The thermal decomposition temperature and char yield both increased significantly upon increasing the DDSQ content, with the DDSQ units providing an inorganic protection layer on the phenolic surface, as confirmed through XPS analyses. We obtained carbon/DDSQ hybrids from the phenolic/DDSQ hybrids after thermal curing and calcination at 900 °C; these carbon/DDSQ hybrids displayed electrochemical properties superior to those of previously reported counterparts.

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“…The incorporation of inorganic nanoparticles into self-assembled BCPs in the form of block copolymer/nanoparticle (BCP/NP) composites, with the blends stabilized through specific interactions, has potential applications in nanodevices, photonics, and sensors [19][20][21][22][23]. Polyhedral oligomeric silsesquioxanes (POSSs) are particularly useful nanoparticles for the preparation of hybrid materials, because they typically have cage-like structures with dimensions of 1-3 nm [24][25][26][27][28][29]. In general, functionalized POSS NPs have been prepared with one, two, or eight functionalized units; we have discussed their effects on the self-assembled structures of BCP hybrid complexes in several previous reports [30][31][32].…”

Section: Introductionmentioning

confidence: 99%

Main Chain–Type Block Copolymers through Atom Transfer Radical Polymerization from Double-Decker–Shaped Polyhedral Oligomeric Silsesquioxane Hybrids

et al. 2020

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In this study, we synthesized two main chain–type block copolymers featuring hydrogen bond donor and acceptor segments through atom transfer radical polymerization (ATRP) using a bifunctionalized polyhedral oligomeric silsesquioxane (POSS) nanoparticle as the initiator. Hydrosilylation of vinylbenzyl chloride at the two corners of a double-decker silsesquioxane (DDSQ) provided the bifunctionalized benzyl chloride initiator VBC-DDSQ-VBC, which we applied as a platform to prepare a main chain–type polystyrene homopolymer (PS-DDSQ-PS), the diblock copolymer poly(styrene–b–4-vinylpyridine) (P4VP-b-PS-DDSQ-PS-b-P4VP), and the diblock copolymer poly(styrene–b–tert-butoxystyrene) (PtBuOS-b-PS-DDSQ-PS-b-PtBuOS) through sequential ATRP. Selective hydrolysis of the tert-butoxyl units of PtBuOS-b-PS-DDSQ-PS-b-PtBuOS yielded the strongly hydrogen bonding diblock copolymer poly (styrene-b-vinylphenol) (PVPh-b-PS-DDSQ-PS-b-PVPh). We used Fourier transfer infrared spectroscopy, nuclear magnetic resonance spectroscopy, size exclusion chromatography, differential scanning calorimetry, mass-analyzed laser desorption ionization mass spectrometry, and transmission electron microscopy to investigate the chemical structures, thermal behavior, and self-assembled nanostructures formed by these main chain–type block copolymers based on DDSQ.

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Minimizing the Strong Screening Effect of Polyhedral Oligomeric Silsesquioxane Nanoparticles in Hydrogen-Bonded Random Copolymers

Cited by 17 publications

References 36 publications

Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration

Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration

Highly Thermal Stable Phenolic Resin Based on Double-Decker-Shaped POSS Nanocomposites for Supercapacitors

Main Chain–Type Block Copolymers through Atom Transfer Radical Polymerization from Double-Decker–Shaped Polyhedral Oligomeric Silsesquioxane Hybrids

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