2022 China Semiconductor Technology International Conference (CSTIC) 2022
DOI: 10.1109/cstic55103.2022.9856787
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Minimizing residual stress of aluminum nitride (AlN) thin films using multi-step deposition of DC pulsed sputtering

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Cited by 2 publications
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“…However, AlN PMUTs based on MEMS process is sensitive to stress due to their inherent characteristics resulting from the suspended structure made of multi-layered thin films. Residual stress in AlN film still poses a significant challenge [10]. Additionally, considering subsequent steps during its package and assembly, different functional materials such as acoustic matching material and water sealing being used, the difficulty in stress control and design of PMUT further increases.…”
Section: Introductionmentioning
confidence: 99%
“…However, AlN PMUTs based on MEMS process is sensitive to stress due to their inherent characteristics resulting from the suspended structure made of multi-layered thin films. Residual stress in AlN film still poses a significant challenge [10]. Additionally, considering subsequent steps during its package and assembly, different functional materials such as acoustic matching material and water sealing being used, the difficulty in stress control and design of PMUT further increases.…”
Section: Introductionmentioning
confidence: 99%
“…However, AlN PMUTs based on the MEMS process are sensitive to stress due to their inherent characteristics resulting from the suspended structure made of multi-layered thin films. Residual stress in an AlN film still poses a significant challenge [ 10 ]. Additionally, considering subsequent steps during its packaging and assembly, when different functional materials such as acoustic matching material and water sealing are used, the difficulty of controlling stress and designing a PMUT further increases.…”
Section: Introductionmentioning
confidence: 99%