2015
DOI: 10.1016/j.nima.2015.07.056
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Minimization of power consumption during charging of superconducting accelerating cavities

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Cited by 6 publications
(11 citation statements)
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“…The power applied during the charging phase is modulated to improve the energy efficiency of the overall system. This was demonstrated at the module level and higher energy efficiency for SSPA with envelope tracking (ET SSPA) is foreseen, in comparison to other methods of powering superconductive cavities [16,17]. Actually, a conventional procedure for charging those cavities is using a step charging profile.…”
Section: Sspa Development At Freiamentioning
confidence: 99%
“…The power applied during the charging phase is modulated to improve the energy efficiency of the overall system. This was demonstrated at the module level and higher energy efficiency for SSPA with envelope tracking (ET SSPA) is foreseen, in comparison to other methods of powering superconductive cavities [16,17]. Actually, a conventional procedure for charging those cavities is using a step charging profile.…”
Section: Sspa Development At Freiamentioning
confidence: 99%
“…This paper showcases the practical implementation at the kilowatt level of the theoretical framework proposed in [3], while also enabling the potential extrapolation to the nominal power of 400 kW. The optimal charging power profile is implemented without compromising energy efficiency by dynamically modulating the drain voltage.…”
Section: Introductionmentioning
confidence: 99%
“…During the initial filling phase, the cavities act as mismatched load resulting in significant reflected RF power, see Fig. 1 where the theoretical computations illustrate the forward and reflected power profiles for both step charging and optimal charging schemes, as presented in [3].…”
Section: Introductionmentioning
confidence: 99%
“…Normally, PAs are designed to operate with a fixed output load. However, they can be forced to operate under varying load conditions due to various causes and in different scenarios, such as microwave cooking [1], plasma heating in, e.g., plasma-enhanced chemical vapor deposition (PECVD) processes [2], or in the charging of particle accelerators cavities [3]. In telecommunication applications, the PA output load can also change due to moving objects on the antenna proximity, e.g., the hand effect [4], or also Manuscript…”
mentioning
confidence: 99%