2020
DOI: 10.1016/j.vacuum.2019.109000
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Minimal multi-target plasma sputtering tool

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Cited by 9 publications
(6 citation statements)
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“…Hence, sputtering only changes the surface roughness of the samples that in turn modifies the optical properties of the samples as mentioned in our earlier paper [5]. Sputtering by low energy ion beam bombardment has also been used to prepare the multi-layer metal thin films by K. Takahashi et al [51]. The irradiation or treatment time decides the fluence of the ions.…”
Section: Experimental Setup and Methodologymentioning
confidence: 96%
“…Hence, sputtering only changes the surface roughness of the samples that in turn modifies the optical properties of the samples as mentioned in our earlier paper [5]. Sputtering by low energy ion beam bombardment has also been used to prepare the multi-layer metal thin films by K. Takahashi et al [51]. The irradiation or treatment time decides the fluence of the ions.…”
Section: Experimental Setup and Methodologymentioning
confidence: 96%
“…Thus, it does not require a clean room for the fab and reduces the development and production costs for high-mix and low-volume products. Figure 10 shows a photograph of the minimal multi-target sputtering tool developed by some of authors [70]. All of the components composing each tool, e.g., a wafer transfer mechanics, a programmable controller, a vacuum chamber, a pumping system, a mass flow controller, AC-DC convertors, an rf plasma source, and an rf generator, have to be contained in a compact frame of 29.5 cm in width, 45 cm in depth, and 144 cm in height, which is standardized to connect the different processing tools.…”
Section: Industrial Plasmasmentioning
confidence: 99%
“…In a traditional rf plasma source system, output rf power from a generator is transferred to a load via an impedance matching box consisting of two variable ca-Fig. 10 Photograph of a minimal multi-target sputtering tool [70].…”
Section: Industrial Plasmasmentioning
confidence: 99%
“…2014; Takahashi et al. 2020). In those types of sources, an external magnetic field and a radiofrequency generator are required; the cost is more expensive and the system becomes complicated compared with the magnetron source.…”
Section: Introductionmentioning
confidence: 99%
“…This type of source has a good efficiency and a low cost with a simple structure and electrical circuits, while the plasma production and sputtering cannot be individually controlled (Gudmundsson 2020). Other types of sputtering reactors such as electron cyclotron resonance or helicon-type sputtering that can control the ion energy and target bias separably have also been developed (Kanno et al 1996;Chabert et al 2000;Muñoz-García et al 2014;Takahashi et al 2020). In those types of sources, an external magnetic field and a radiofrequency generator are required; the cost is more expensive and the system becomes complicated compared with the magnetron source.…”
mentioning
confidence: 99%