2018
DOI: 10.1080/14686996.2018.1460177
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Miniaturized planar Si-nanowire micro-thermoelectric generator using exuded thermal field for power generation

Abstract: For harvesting energy from waste heat, the power generation densities and fabrication costs of thermoelectric generators (TEGs) are considered more important than their conversion efficiency because waste heat energy is essentially obtained free of charge. In this study, we propose a miniaturized planar Si-nanowire micro-thermoelectric generator (SiNW-μTEG) architecture, which could be simply fabricated using the complementary metal–oxide–semiconductor–compatible process. Compared with the conventional nanowir… Show more

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Cited by 46 publications
(31 citation statements)
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References 42 publications
(28 reference statements)
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“…Moreover, PnCs can reduce the thermal conductivity [5,6]. Thus, PnCs can enhance the thermoelectric efficiency of poor thermoelectric materials, such as silicon [79], and be used in energy harvesting applications [10,11] along with other nanostructured [1114] and hierarchical [15,16] materials.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, PnCs can reduce the thermal conductivity [5,6]. Thus, PnCs can enhance the thermoelectric efficiency of poor thermoelectric materials, such as silicon [79], and be used in energy harvesting applications [10,11] along with other nanostructured [1114] and hierarchical [15,16] materials.…”
Section: Introductionmentioning
confidence: 99%
“…and low electrical/thermal contact resistance (Noroozi et al, 2017b). NiSi has also been a good choice for electrodes for those µTEG heated from the outside (Zhan et al, 2018). AlN films are adopted as thermally conductive layers for TEG with 300/500 nm thickness and the respective thermal conductivity is 4 and 11 W m −1 K −1 .…”
Section: Thermal and Electrical Contact Resistancementioning
confidence: 99%
“…Generally, µTEGs with this structure are easy to design, and they have large output power and high conversion efficiency. However, the defects come from the difficult and expensive fabrication process, like the deepetching in the top-down methods, or the well-controlled NW synthesis and metal electrodes integration in the bottom-up methods (Zhan et al, 2018). The lateral structure µTEG, which is compatible with the CMOS process, is relatively easy to fabricate (Xie et al, 2010;Yu et al, 2012Yu et al, , 2015Noroozi et al, 2017b).…”
Section: Design and Application Of µTeg µTeg Designmentioning
confidence: 99%
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“…Nagy et al investigated the local discharge characteristics of artificial microdefects such as cracks, voids, and delamination generated using precise production control and demonstrated the effect of defects on insulator performance [7]. Zhan et al proposed to first use the cubic background of the weld image to be detected is simulated by curve fitting, and the simulated background image is numerically subtracted from the original weld image to obtain a weld image with a more uniform background grayscale distribution and a higher detail of defect information, and finally, an appropriate threshold is selected to extract and segment the defects in the weld image [8]. The method is effective in extracting relatively obvious defects to a certain extent, but it is not effective in extracting defects of complex shapes.…”
Section: Current Status Of Researchmentioning
confidence: 99%