Abstract:This paper presents a very low-profile on-ground chip antenna with a total volume of 0.075λ0× 0.056λ0× 0.019λ0 (at f0 = 2.4 GHz). The proposed design is a corrugated (accordion-like) planar inverted F antenna (PIFA) embedded in low-loss glass ceramic material (DuPont GreenTape 9k7 with ϵr = 7.1 and tanδ = 0.0009) fabricated with LTCC technology. The antenna does not require a clearance area on the ground plane where the antenna is located, and it is proposed for 2.4 GHz IoT applications for extreme size-limite… Show more
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