Miniaturized Lumped Coupler with Low Frequency Signals Suppression

Miniaturized lumped‐element low‐temperature co‐fired ceramic balun using capacitance‐enhanced capacitors

“…Recently, circuit miniaturization is popular using low-temperature co-fired ceramic (LTCC)-based system-in-package technologies. [2][3][4][5][6][7] With the wide applications of traditional vertically interdigital capacitors (VICs), passive components become smaller with high Q-factors. [8][9][10][11][12][13][14] With the progress in semiconductor technologies, a high performance transformer balun is made with very low magnitude imbalance and phase imbalance using 0.13 μm SiGe technology.…”

“…Therefore, it is impractical to make smaller circuits at a few megahertz frequencies with low capacitance or inductance density elements. Recently, circuit miniaturization is popular using low‐temperature co‐fired ceramic (LTCC)‐based system‐in‐package technologies 2–7 . With the wide applications of traditional vertically interdigital capacitors (VICs), passive components become smaller with high Q‐factors 8–14 .…”

Highly Packaged LTCC Coupler Using Vertically Stacked LC-elements for 1 and 1.5 Tesla MRI Applications

“…As the application frequencies are less than 100 MHz, lumped inductor and capacitor (LC)elements are used for the design for miniaturizations. Recently, many couplers which use lumped elements [2][3][4][5][6][7][8][9][10] have been reported. Low temperature co-fired ceramic (LTCC) three-dimensional (3D) packaging technique, characterized by having significant advantages in high integration, low cost of mass production, and satisfactory performance, has become the most promising high-density circuit integration technology.…”

“…Therefore, LTCC fabrication process becomes the first choice in this work. However, couplers in [2,3] do not fully utilize the LTCC vertical dimensions because of the complicated design process and fabrication cost.…”