2017
DOI: 10.1109/tcpmt.2017.2708704
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Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules

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Cited by 26 publications
(12 citation statements)
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“…Table 1 compares on-chip filters based on different processes with the proposed BPF, which provides higher performance with fewer metal layers than a low temperature co-fired ceramic BPF [8] or a glass IPD BPF [22]. The return loss above 20 dB of the proposed BPF indicates that almost no reflected signal occurs at the center frequency, and the best insertion loss was obtained among the compared BPFs [8,[21][22][23][24][25]. GaAs can provide better insulation and less signal loss than silicon substrate; in addition, the working power of GaAs is higher than glass [26].…”
Section: Discussionmentioning
confidence: 99%
“…Table 1 compares on-chip filters based on different processes with the proposed BPF, which provides higher performance with fewer metal layers than a low temperature co-fired ceramic BPF [8] or a glass IPD BPF [22]. The return loss above 20 dB of the proposed BPF indicates that almost no reflected signal occurs at the center frequency, and the best insertion loss was obtained among the compared BPFs [8,[21][22][23][24][25]. GaAs can provide better insulation and less signal loss than silicon substrate; in addition, the working power of GaAs is higher than glass [26].…”
Section: Discussionmentioning
confidence: 99%
“…The integrated passive device (IPD) process is a recent manufacturing technology that has been proposed as a solution for use in RF/microwave device fabrication. It provides simplified and compact modules with high performance through the integration of components with small parasitic effects [ 22 , 23 , 24 , 25 , 26 , 27 , 28 , 29 , 30 ].…”
Section: Introductionmentioning
confidence: 99%
“…Although acoustic-wave filters such as the ones based on surface acoustic wave (SAW) resonators and bulk acoustic (BAW) resonators have been the major RF filtering technology for cellular communications, they are limited to narrow-band single-band transfer functions and frequencies <2 GHz. Integrated passive devices (IPDs) based filters using silicon [1][2][3], microwave monolithic integrated circuits (MMIC) [4], or low-temperature co-fired ceramic (LTCC) [5,6] and glass substrates [7][8][9][10][11][12] functionalize significantly wider BWs, and are suitable for higher frequencies; however, they exhibit lower quality-factor than the SAW/BAW filters and are significantly larger in size. Among the existing IPD technologies, glass-based IPDs exhibit competitive RF performance for both FR1 [7][8][9][10][11] and FR2 [12] applications.…”
mentioning
confidence: 99%
“…Integrated passive devices (IPDs) based filters using silicon [1][2][3], microwave monolithic integrated circuits (MMIC) [4], or low-temperature co-fired ceramic (LTCC) [5,6] and glass substrates [7][8][9][10][11][12] functionalize significantly wider BWs, and are suitable for higher frequencies; however, they exhibit lower quality-factor than the SAW/BAW filters and are significantly larger in size. Among the existing IPD technologies, glass-based IPDs exhibit competitive RF performance for both FR1 [7][8][9][10][11] and FR2 [12] applications. Notable demonstrations of these trends include single-band quasi-elliptic bandpass filters (BPFs) for n77 and n79 bands [7,8] and inverter-less single and dual-band BPFs configurations in [10].…”
mentioning
confidence: 99%
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