2017
DOI: 10.1109/lawp.2016.2586749
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Miniaturization of a Circular Patch Microstrip Antenna Using an Arc Projection

Abstract: A semicircle arc projection is introduced to miniaturize the patch in circular patch microstrip antennas. The idea has been inspired from the effectiveness of a cuboid ridge in size reduction of a rectangular patch microstrip antenna. A prototype of the proposed antenna together with a prototype of a conventional circular patch antenna has been fabricated and measured. The two antennas are compared, and the results are presented and discussed. A parametric study is also carried out on the characteristics of th… Show more

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Cited by 26 publications
(12 citation statements)
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“…A design with four L-shaped shorting strips is proposed in [12] to reduce the patch size. A semicircle arc projection method using nonuniform patches has been employed in [13] to effectively reduce the patch size. High level of miniaturization can be realized by adding a metamaterial-inspired layer [14] in between the ground plane and radiator patch layer without affecting the radiation efficiency of the patch.…”
Section: Introductionmentioning
confidence: 99%
“…A design with four L-shaped shorting strips is proposed in [12] to reduce the patch size. A semicircle arc projection method using nonuniform patches has been employed in [13] to effectively reduce the patch size. High level of miniaturization can be realized by adding a metamaterial-inspired layer [14] in between the ground plane and radiator patch layer without affecting the radiation efficiency of the patch.…”
Section: Introductionmentioning
confidence: 99%
“…The Internet of Things requires antennas to be integrated into different factors and next to different materials. In parallel to this, there is the need to create extra degrees of freedom for the RF engineer to improve performance by developing bespoke dielectric materials [5], graded dielectric properties, or 3D shapes [6]. 3D printing allows the flexibility to design air inclusions in the dielectric host.…”
Section: Introductionmentioning
confidence: 99%
“…The second one is to employ additional metallic via‐holes and lumped loads: A metallic via‐hole can be used to reduce the resonant frequency and to generate dual‐band resonant characteristics . By modifying a single metallic via‐hole into multiple via‐hole columns or short circuited walls, more compact sizes, or more reduced heights can be achieved. Using resistive or hybrid lumped element loading can also lead to compact, wideband designs at the cost of reduced radiation efficiency .…”
Section: Introductionmentioning
confidence: 99%
“…8 More recently, by using asymmetrical slits, 9 slit-meandered-line combinations 10 and multi-slot loaded techniques, 11 more compact, performance enhanced antennas can be realized. The second one is to employ additional metallic via-holes 4,[12][13][14][15][16][17] and lumped loads 18 : A metallic via-hole can be used to reduce the resonant frequency 4,13 and to generate dual-band resonant characteristics. 12,14,15 By modifying a single metallic via-hole into multiple via-hole columns 16 or short circuited walls, 17 more compact sizes, or more reduced heights can be achieved.…”
Section: Introductionmentioning
confidence: 99%
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