Abstract:Thermal management of modern electronics has become a problem of significant interest due to the demand for power and reduction in packaging size. Requirements of next-generation microprocessors in terms of power dissipation and heat flux will certainly outgrow the capability of today’s thermal control technology. LHPs, like conventional heat pipes, are capillary pumped heat transport devices. They contain no mechanical moving part to wear out or require electrical power to operate. But unlike heat pipes, LHPs… Show more
“…Currently, LHP miniaturization is in the forefront of an extensive research and development to provide cooling solutions to the high heat load/heat flux problem of advanced electronic packaging [20][21][22][23][24][25][26][27][28]. The constrained space of such applications requires to design specific LHPs.…”
Section: Introductionmentioning
confidence: 99%
“…The constrained space of such applications requires to design specific LHPs. Various models have been developed for the LHP characterization [7,23,[29][30][31][32]. The steady state models are useful to size new-designed LHPs and to predict LHP performance for various fixed external conditions.…”
“…Currently, LHP miniaturization is in the forefront of an extensive research and development to provide cooling solutions to the high heat load/heat flux problem of advanced electronic packaging [20][21][22][23][24][25][26][27][28]. The constrained space of such applications requires to design specific LHPs.…”
Section: Introductionmentioning
confidence: 99%
“…The constrained space of such applications requires to design specific LHPs. Various models have been developed for the LHP characterization [7,23,[29][30][31][32]. The steady state models are useful to size new-designed LHPs and to predict LHP performance for various fixed external conditions.…”
“…Among the steady-state devices, the most studied are the capillary driven two-phase loops, such as the Capillary Pumped Loop (Platel et al, 1995;Chen and Lin, 2001) and Loop Heat Pipes (Hoang et al, 2003;Riehl and Dutra, 2005;Maydanik, 2005).…”
“…Many efforts are directed to the improvement of the design of miniature loop heat pipes (mLHPs) being easier fitting them inside very small and compact electronic equipment [4,5]. A great advantage for loop systems with respect to conventional heat pipes, is their wide flexibility in the design of the evaporator and condenser sections.…”
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