Miniature 3D micro-machined solid state power amplifiers

Immorlica, A.A.; Actis, R.; Nair, Deepukumar M.; Vanhille, Kenneth; Nichols, C.; Rollin, Jean-Marc; Fleming, D.J.; Varghese, Ronnie; Sherrer, David; Filipović, Dejan S.; Cullens, Evan; Ehsan, Negar; Popović, Zoya

doi:10.1109/comcas.2008.4562783

Cited by 5 publications

(3 citation statements)

References 4 publications

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“…Plated metal processes are heavily used in MEMS power [1] and RF components [2] due to their ability to quickly and cheaply deposit thick layers for low resistances and correspondingly low power losses. For large released devices, mechanical supports are often necessary to improve robustness and to prevent deflection and shorting with neighboring structures.…”

Section: Introductionmentioning

confidence: 99%

“…For large released devices, mechanical supports are often necessary to improve robustness and to prevent deflection and shorting with neighboring structures. Since electroplated metals are conductive, creating resistive or dielectric supports has traditionally been done by the deposition and patterning of additional dielectric materials-typically polymers as in [1] and [2]. Although the ability of copper to form thick layers of oxides has been viewed as a major problem, especially in MEMS packaging where exposure to temperatures of several hundred degrees Celsius may be required [3], this property can be leveraged to completely oxidize structures larger than would be possible for other materials.…”

Section: Introductionmentioning

confidence: 99%

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Thick film oxidation of copper in an electroplated MEMS process

Lazarus¹,

Meyer²,

Bedair³

et al. 2013

J. Micromech. Microeng.

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Copper forms a porous oxide, allowing the formation of oxide layers up to tens of microns thick to be created at modest processing temperatures. In this work, the controlled oxidation of copper is employed within an all-metal electroplating process to create electrically insulating, structural posts and beams. This capability could eliminate the additional dielectric deposition and patterning steps that are often needed during the construction of sensors, waveguides, and other microfabricated devices. In this paper, copper oxidation rates for thermal and plasma-assisted growth methods are characterized. Time control of the oxide growth enables larger copper structures to remain conductive while smaller copper posts are fully oxidized. The concept is demonstrated using the controlled oxidation of a copper layer between two nickel layers to fabricate nickel inductors having both copper electrical vias and copper oxide support pillars. Nickel was utilized in this demonstration for its resistance against low temperature oxidation and interdiffusion with copper.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Thick film oxidation of copper in an electroplated MEMS process

Lazarus¹,

Meyer²,

Bedair³

et al. 2013

J. Micromech. Microeng.

View full text Add to dashboard Cite

show abstract

“…Introduction: The trend for the modern solid state power amplifier (SSPA) application is to generate higher power, more compact systems and a competitive cost. To reach such goals, a specific investigation on power splitters and combiners is essential [1,2]. Indeed, these devices are crucial for the improvement of transmission/reception performances of antennas.…”

mentioning

confidence: 99%

Electromagnetic and thermal study of low loss and compact air dielectric stripline in X‐band

et al. 2014

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The concept of a microwave transmission line suspended in air, and a methodology for electromagnetic and thermal optimisation of these structures in X-band (8-12 GHz) are reported. A reliable printed circuit process allows us to obtain compact, low loss and reproducible stripline structures. The measured stripline circuits demonstrate losses from only 4.2 to 5.2 dB/m at 9 GHz. The use of periodic ceramic contacts increases the power capability up to 50 W. The final structure is low loss and compact with high power handling in order to be used in power combination in the X-band.Introduction: The trend for the modern solid state power amplifier (SSPA) application is to generate higher power, more compact systems and a competitive cost. To reach such goals, a specific investigation on power splitters and combiners is essential [1,2]. Indeed, these devices are crucial for the improvement of transmission/reception performances of antennas. Consequently, reduction of their losses at strategic locations such as the upstream and the downstream front-end is critical. Power distribution and combination solutions of the full dielectric stripline present high losses, typically from 10 to 26 dB/m at 9.5 GHz [3], losses which are essentially due to the dielectric material. To increase the electrical performances, an air gap is generally introduced in the stripline structure. However, this solution increases the structural dimensions (effective permittivity decreases), which becomes a constraint for compact SSPA systems, and reduces the power capability, as the thermal transfer is then less efficient. Our aim is to use electromagnetic and thermal optimisation methods to reach the best trade-off between losses and compactness, with high power capacity to enable the next generation of stripline power combiners.

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Never ending saga of phased array breakthroughs

Brookner

2010

2010 IEEE International Symposium on Phased Array Systems and Technology

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Miniature 3D micro-machined solid state power amplifiers

Cited by 5 publications

References 4 publications

Thick film oxidation of copper in an electroplated MEMS process

Thick film oxidation of copper in an electroplated MEMS process

Electromagnetic and thermal study of low loss and compact air dielectric stripline in X‐band

Never ending saga of phased array breakthroughs

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