Millimeter-wave CMOS design

Doan, C.H.; Emami, S.; Niknejad, Ali M.; Brodersen, R.W.

doi:10.1109/jssc.2004.837251

Cited by 634 publications

(266 citation statements)

References 12 publications

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“…The 60 GHz band is considered to be a promising candidate for building such high speed, short range wireless networks for a number of reasons: it offers large swathes of unused bandwidth (57-64 GHz) and has a high spatial frequency reuse because of significant attenuation due to oxygen absorption [1]. Crucially, recent advances in RFIC design have made millimeter wave (mm-wave) transceivers using inexpensive silicon processes feasible [2] [3]. While there is intense industry interest in multiGigabit 60 GHz indoor networks [4], recent work [5] shows that outdoor mesh networks based on short-range (100s of meters) 60 GHz links are a promising approach to providing a quickly deployable multiGigabit wireless backhaul (e.g.…”

Section: Introductionmentioning

confidence: 99%

Channel Modeling and MIMO Capacity for Outdoor Millimeter Wave Links

Zhang

Venkateswaran

Madhow

2010

2010 IEEE Wireless Communication and Networking Conference

109

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Abstract-Recent work has shown that mesh networks based on short-range outdoor millimeter (mm) wave links in the unlicensed 60 GHz band are a promising approach to providing an easily deployable broadband infrastructure. In this paper, we investigate the robustness of such links, focusing in particular on the effect of multipath fading resulting from reflections from the ground and building walls for a lamppost deployment of mm wave nodes. Our ray tracing based model shows that, while only a small number of paths are significant for the highly directional links considered, they can cause significant fluctuations in the received signal strength. Our simulations show that 10-20 dB fades below the benchmark of free space propagation can occur quite easily (e.g., 5-15% of the time, averaging across typical deployment scenarios), and that the received power is extremely sensitive to small variations in geometry (e.g., altering the position of the antenna by 1 cm can reduce the received power as much as 46.7 dB). We also demonstrate, however, that extremely robust performance can be obtained by employing multiple antennas at appropriately chosen separations, using standard space-time communications strategies such as transmit precoding (when the transmitter knows the channel) and space-time coding (when the transmitter does not know the channel).

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Section: Introductionmentioning

confidence: 99%

Channel Modeling and MIMO Capacity for Outdoor Millimeter Wave Links

Zhang

Venkateswaran

Madhow

2010

2010 IEEE Wireless Communication and Networking Conference

109

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“…A. Summary Table I is a summary of the simulated and measured results compared to two references [6], [7], both at 60 GHz and in CMOS, but not frequency converting. The authors would like to make a comment about the power gain.…”

Section: Measurement Resultsmentioning

confidence: 99%

“…1. In cases where higher output power and more gain is needed, more stages can be used [6], [7]. Both amplifiers convert a 30 GHz input signal to a 60 GHz output.…”

Section: Circuit Topologiesmentioning

confidence: 99%

“…The 2.0 μm thick top metal layer was used for the TLs, and metal 1 for ground plane. The width of the TLs was chosen to give a 50 Ω characteristic impedance, which also resulted in a high Q-value, see [10] and [6] for a more thorough investigation of TLs in silicon processes.…”

Section: A Transmission Linesmentioning

confidence: 99%

“…Despite this discrepancy tline3 has been used to simulate the amplifiers, leading to a somewhat pessimistic gain, but still a correct resonance frequency. The Q-values and inductances are in the same range as in [6], [10].…”

Section: A Transmission Linesmentioning

confidence: 99%

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60 GHz 130-nm CMOS second harmonic power amplifiers

Wernehag

Sjöland

2008

APCCAS 2008 - 2008 IEEE Asia Pacific Conference on Circuits and Systems

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Abstract-Two different frequency doubling power amplifiers have been measured, one with differential and one with singleended input, both with single-ended output at 60 GHz. The amplifiers have been implemented in a 1p8M 130-nm CMOS process. The resonant nodes are tuned to 30 GHz or 60 GHz using on-chip transmission lines, which have been simulated in ADS and Momentum.The measured input impedance of the single-ended PA is high at 250 Ω, and the differential input is similar, making the PA a suitable load for an oscillator in a fully integrated transmitter. The single-ended and differential input PA delivers 1 dBm and 3 dBm, respectively, of measured saturated output power to 50 Ω, both with a drain efficiency of 8%.

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Modeling and Characterization of On‐Chip Interconnects

Wang

Zhao

2013

Wiley Encyclopedia of Electrical and Electronics Engineering

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In this article, one distributed circuit model for the on‐chip single interconnect will be introduced at first, where all the lumped elements are frequency independent and can be directly obtained from its geometrical and physical parameters. This ensures proper scalability of the model parameters because no optimization tuning or fitting for them is involved. Some popular and low‐cost techniques, such as patterned ground shield (PGS) structures for suppressing the substrate loss of silicon substrate at high frequencies and differential signal transmission, are also addressed here. Then, electromagnetic modeling of on‐chip coupled (a)symmetrical interconnects will be performed, including all distributed parameters. The average power handling capability (APHC) of on‐chip interconnects and even thin‐film microstrip lines (TFML) are also addressed here. Finally, the electrothermal analysis of multilevel interconnects under electrostatic discharge (ESD) stress will be reported using the time‐domain finite‐element method (FEM).

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Millimeter-wave CMOS design

Cited by 634 publications

References 12 publications

Channel Modeling and MIMO Capacity for Outdoor Millimeter Wave Links

Channel Modeling and MIMO Capacity for Outdoor Millimeter Wave Links

60 GHz 130-nm CMOS second harmonic power amplifiers

Modeling and Characterization of On‐Chip Interconnects

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