“…Thus, the MOF porous carrier MIL-101(Cr)-NH 2 is highly suitable for CPCM application owing to its straightforward preparation, low density, and costeffectiveness. 35 Moreover, the low thermal conductivity of MOF-encapsulated PCMs can be improved by adding a large amount of a thermally conductive filler through melt blending. 36 However, this method reduces the mass fraction of PCMs, resulting in a lower latent heat, 37,38 and increases the cost, making the preparation of efficient CPCMs difficult.…”